Features: 6010, Taiwan high guide plate pressure 3000V heat conduction 1.2-2.0, Japan imported solar ink 280 degrees, reflow soldering is not yellow

  

 

Technical details: under normal circumstances, as long as the hot pressing section of the laminate exceeds 30min, the copper foil and the semi cured sheet are basically combined, so the bonding force of the copper foil and the base material are not influenced by the press bonding in general. but in the process of laminate stacking, stacked, or if the PP pollution, copper hair surface damage, can also cause after lamination combined with the copper foil and substrate power is insufficient, resulting in positioning (only for large terms) or sporadic copper loss, but measured near the peel strength off-line will not have abnormal.

  

 

Usage method: (1) the utility model can be bent, wound and folded, arranged arbitrarily according to the space layout requirement, and can be freely moved and stretched in three-dimensional space, so as to achieve the integration of the assembly of the components and the connection of the wires;
(2) the use of FPC can greatly reduce the volume and weight of electronic products, and is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communications, portable computers, computer peripherals, PDA, digital cameras and other fields or products;
(3) FPC also has good heat resistance and weldability, easy installation and low cost advantages, even integrated design, hardware and software combination also make up the flexible substrate in the element bearing the limitations slightly in a certain extent

  

 

Packing: Press mold vacuum packaging