Specification:

Laser class	1
Max. Working area (X x Y x Z)	300 mm x 300 mm x 11 mm
Max. Recognition area (X x Y)	300 mm x 300 mm
Max. Material size (X x Y)	350 mm x 350 mm
Data input formats	Gerber, X-Gerber, DXF, HPGL,
Max. Structuring speed	Depends on application
Positioning accuracy	25 m (1 Mil)
Diameter of focused laser beam	20 m (0.8 Mil)
Laser wavelength	355 nm
System dimensions (W x H x D)	1000mm*940mm *1520 mm
Weight	~ 450 kg (990 lbs)
Power supply	230 VAC, 50-60 Hz, 3 kVA
Cooling	Air-cooled (internal water-air cooling)
Ambient temperature	22 C 2 C @ 25 m / 22 C 6 C @ 50 m (71.6 F 3.6 F @ 1 Mil / 71.6 F 10.8 F @ 2 Mil)
Humidity	< 60 % (non-condensing)
Required accessoires	Exhaust unit

Features:

1. Neat and smooth edge, no burr or overflow;
2. More quick and easy, shorten the delivery time;
3. More quick and easy, shorten the delivery time
4. High quality,no distortion,surface clean& uniformity;
5. Gathering the CNC tech,laser tech,software techHigh accuracy,High speed;
6. Pre-camera vision product position registration and model check;
7. Coherent Avia NX UV laser with HurrySCAN head;
8. High capacity BOFA dust collecto;
9. User friendly Window based software;
10. PCB flexible product jig adjustable for different board size;
11. High resolution and accurate Z stage with auto-focus function;
12. Large area low friction front loading platform for sliding multiple product jigs;
13. Fully covered class 1 safety enclosure;
14. Able to do cutting and marking together;
15. Compact size.

Dvantages:

1.High precision CCD automatic positioning, automatic focusing. Fast and accurate positioning, save time and no worries.

2.Friendly interface,Simple operation, easy to use, free application; Small size, Save more space; rigorous security design;

3.Reduce energy consumption, Cost savings.

Cost-effective, fast cutting speed, stable performance

Working principle:

Humidity sensor ( humidity and temperature signal ) Microcomputer ( CPU Central Processing Unit ) Heaters  ( PTC heating module polymer material heating ) Smart shape memory alloy ( alloy shape with temperature change ) Balance spring ( general balance spring with alloy )

Description:

PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. however, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. this brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.

Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.

Laser PCB Depaneling Machine Application:

FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting