Cut PCB with Laser PCB Depanel Machine,PCB & FPC Depaneling Equipment,CWVC-5S Features:

 Pre-camera vision product position registration and model check
 Coherent Avia NX UV laser with HurrySCAN head
 High capacity BOFA dust collector
 User friendly Window based software
 PCB flexible product jig adjustable for different board size
 High resolution and accurate Z stage with auto-focus function
 Large area low friction front loading platform for sliding multiple product jigs
 Fully covered class 1 safety enclosure
 Able to do cutting and marking together
 Compact size
. Neat and smooth edge, no burr or overflow
. More quick and easy, shorten the delivery time;
. High quality,no distortion,surface clean& uniformity;
. Gathering the CNC tech,laser tech,software techHigh accuracy,High speed

Detailed Product Description

Product Name:	Laser PCB Separator	Super:	Low Power Consumption.
Laser:	12/15/17W	Laser Brand:	Optowave
Power:	220V 380v	Warranty:	1 Year

Cut PCB with Laser PCB Depanel Machine,PCB & FPC Depaneling Equipment,CWVC-5S Specification:

Laser	Q-Switched diode-pumped all solid-state UV laser
Laser Wavelength	355nm
Laser Power	10W/12W/15W/17W@30KHz
Positioning Precision of Worktable of Linear Motor	2m
Repetition Precision of Worktable of Linear Motor	1m
Effective Working Field	460mmX460mm(Customizable)
Laser Scanning Speed	2500mm/s (max)
Galvanometer Working Field Per One Process	40mm40mm

Challenges of Depaneling using Routing/Die Cutting/Dicing Saws

 Damages and fractures to substrates and circuits due to mechanical stress

 Damages to PCB due to accumulated debris

 Constant need for new bits, custom dies, and blades

 Lack of versatility each new application requires ordering of custom tools, blades, and dies

 Not good for high precision, multi-dimensional or complicated cuts

 Not useful PCB depaneling/singulation smaller boards

Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.

Advantages of Laser PCB depaneling/singulation

 No mechanical stress on substrates or circuits

 No tooling cost or consumables.

 Versatility ability to change applications by simply changing settings

 Fiducial Recognition more precise and clean cut

 Optical Recognition before PCB depaneling/singulation process begins.

 Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)

 Extraordinary cut quality holding tolerances as small as < 50 microns.

 No design limitation ability to cut virtually and size PCB board including complex contours and multidimensional boards

Working principle:

Humidity sensor ( humidity and temperature signal ) Microcomputer ( CPU Central Processing Unit ) Heaters  ( PTC heating module polymer material heating ) Smart shape memory alloy ( alloy shape with temperature change ) Balance spring ( general balance spring with alloy )

Cutting Application:

FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.