PCB Laser  with UV Laser,CWVC-6 Description:

Product Name:	Laser PCB Separator	Super:	Low Power Consumption.
Laser:	12/15/17W	Laser Brand:	Optowave
Power:	220V 380v	Warranty:	1 Year

Advantages of Laser PCB Depaneling/singulation:

No mechanical stress on substrates or circuits

No tooling cost or consumables.

Versatility  Ability to change applications by simply changing settings

Fiducial Recognition  More precise and clean cut

Optical Recognition before PCB depaneling/singulation process begins.

Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)

Extraordinary cut quality holding tolerances as small as < 50 microns.

No design limitation  Ability to cut virtually and size PCB board including complex contours and multidimensional boards

Challenges of Depaneling using Routing/Die Cutting/Dicing Saws:

 Damages and fractures to substrates and circuits due to mechanical stress

 Damages to PCB due to accumulated debris

 Constant need for new bits, custom dies, and blades

 Lack of versatility each new application requires ordering of custom tools, blades, and dies

 Not good for high precision, multi-dimensional or complicated cuts

 Not useful PCB depaneling/singulation smaller boards

Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.

PCB Laser Depaneling Machine with UV Laser,CWVC-6 Specification:

Laser	Q-Switched diode-pumped all solid-state UV laser
Laser Wavelength	355nm
Laser Power	10W/12W/15W/17W@30KHz
Positioning Precision of Worktable of Linear Motor	2m
Repetition Precision of Worktable of Linear Motor	1m
Effective Working Field	460mmX460mm(Customizable)
Laser Scanning Speed	2500mm/s (max)
Galvanometer Working Field Per One Process	40mm40mm

Laser class	1
Max. Working area (X x Y x Z)	300 mm x 300 mm x 11 mm
Max. Recognition area (X x Y)	300 mm x 300 mm
Max. Material size (X x Y)	350 mm x 350 mm
Data input formats	Gerber, X-Gerber, DXF, HPGL,
Max. Structuring speed	Depends on application
Positioning accuracy	25 m (1 Mil)
Diameter of focused laser beam	20 m (0.8 Mil)
Laser wavelength	355 nm
System dimensions (W x H x D)	1000mm*940mm *1520 mm
Weight	~ 450 kg (990 lbs)
Power supply	230 VAC, 50-60 Hz, 3 kVA
Cooling	Air-cooled (internal water-air cooling)
Ambient temperature	22 C 2 C @ 25 m / 22 C 6 C @ 50 m (71.6 F 3.6 F @ 1 Mil / 71.6 F 10.8 F @ 2 Mil)
Humidity	< 60 % (non-condensing)
Required accessoires	Exhaust unit

PCB Laser Depaneling Machine with UV Laser,CWVC-6 Cutting Application:

FPC and some relative materials;

FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.

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