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Quick Details

Outer Diameter: 10cm*10cm
Inner Diameter: Silica gel Pad For LED chip
Brand Name: MING&BEN
Working temperature: -45 -200
Scope: Chip and heatsink gap around 0.3mm
Application: LED chip cooling;; Graphics Card;;CPU
Heatsink Material: Silica gel Pad
Thermal conductivity: 5W/mk
Unit Type: piece
Package Size: 10cm x 10cm x 2cm (3.94in x 3.94in x 0.79in)
Package Weight: 0.02kg (0.04lb.)

Specifications

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