Cooling of the heating part of the semiconductor manufacturing device:
Single wafer cleaning transfer, printing machine, automatic holder mounting device, spraying device, ion plating device, etching device, single wafer processing device, slicer, packaging machine, temperature management of developer, exposure device, heating of magnetic part Device, etc.
Cooling of the heating part of the laser device:
Laser processing, heat generation part of fusion splicer, laser marking device, generating device, carbon dioxide laser processing machine, etc.
Cooling of the heating part of other industrial machines:
Plasma welding, automatic packaging machine, mold cooling, washing machine, gold plating tank, precision grinding machine, injection molding machine, molding part of resin molding machine, etc.
Analyze the cooling of the hot part of the machine:
the light source of the electron microscope, the light source portion of the ICP emission spectroscopic analyzer, the heat generating portion of the spectrophotometer, the heat source of the X-ray analysis device, the heat generating portion of the automatic pulse banner device, the light source of the atomic absorption photometer, and the like.
Cooling of the cooling medium of CNC machine tools and machining centers.