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Cu Content (%): 99.96%
Dimensions: Foil
Application: Flexible circuit board
Brand Name: Allotech
Purity: 99.96%
Powder Or Not: Not Powder
Alloy Or Not: Non-alloy
Grade: C1100
Place of Origin: China (Mainland)
Thickness Range: 0.01mm~0.15mm
Widthness: 4mm~400mm
Density: 8.9g/cm3
Temper: Hard,Soft
Softening Temperature: 380C
Used: Flexible Copper Clad Laminate(Fccl), Fine Circuit

Specifications

Rolled Copper Foil 
Rolled Copper Foil has extraordinary strength, bendability, ductility and lustrous surface, plus its excellent mechanical capacity, makes it irreplaceable as a raw material. 
Base Material: C11000 Copper, Cu > 99.90% 
Thickness Range: 0.0004inch~0.006inch (0.01mm-0.15mm) 
Width Range: 0.16inch~16inch (4mm-400mm) 
Temper: Hard, Quarter Hard, Half Hard, Soft 
Application: Transformer, Copper Flexible Connector, CCL, FCCL, PCB, Geothermal Film, Construction, Decoration etc.

GB

ALLOY NO.

SIZE (mm)

(ISO)

(ASMT)

(JIS)

(BIS)

(DIN)

T2

Cu-ETP

C11000

C1100

C101

R-Cu57

Thickness: 0.01-0.15/Max Width: 400

TU2

Cu-of

C10200

C1020

Cu-OFC

of-Cu


 Mechanical Properties

Temper

JIS Temper

Tensile Strength Rm/N/mm 2

Elongation A50/%

Hardness HV

M

O

220~275

15

50~70

Y4

1/4H

240~300

9

65~85

Y

H

330~450

-

100~140

T

EH

380~510

-

-

Note: We can provide products with other properties according to customers` requirements.

Physical Properties 
Density: 8.9g/cm3 
Electrical conductivity (20C): min 90%IACS for annealed to temper 
                                            min 80%IACS for rolled to temper  
Thermal conductivity (20C): 390W/(mC) 
Elastic modulus: 118000N/m 
Softening temperature: 380C

Sizes and Tolerances (mm)

      Thickness

Thickness Tolerances

Width

Width Tolerances

0.01~0.015

0.002

4~250

0.1

> 0.018~0.10

0.003

4~400

> 0.10~0.15

0.005

4~400

Specifications Available (mm)

          Thickness

Width

Temper

0.01~0.015

4250

O,H

> 0.018~0.10

4400

O,H

> 0.10~0.15

4400

O,1/4H,1/2H,H


Ccl Special High Precision Rolled Copper Foil