| Brand Name: | Allotech |
|---|---|
| Alloy Or Not: | Non-alloy |
| Width: | 10~650mm |
| Thickness: | 0.006mm~0.15mm |
| Application: | manufacturing automobile, farmer machine, mining machinery |
| Place of Origin: | China (Mainland) |
| Model Number: | 0047 |
| Cu (Min): | 64% |
| Grade: | H65 C26800 |
| Material: | Brass |
| Density: | 8.5g/cm3 |
| Electric conductivity: | 27%IACS |
| Elastic modulus: | 105000N/mm2 |
| Thermal conductivity: | 120W |
Quick Details
Specifications
Rolled Brass Foil
H65, a copper-zinc alloy, is equivalent to C26800 in ASTM. this material is mainly used for radiator fins.
Chemical Composition (%)
| Cu | Zn |
64~68 |
Balance |
Physical Properties
Density: 8.5g/cm3
Electric conductivity(20 C ): 27%IACS
Thermal conductivity (20 C): 120W/(m C )
Elastic modulus: 105000N/mm2
Thermal expansion coefficient (20-300 C ) 20 X 10 -6 C -1
Specifications Available (mm)
Thickness |
Width |
Temper |
Thickness Tolerances |
Width Tolerances |
0.01~0.15 |
4200 |
O, 1/4H, 1/2H, H |
0.003 |
Width Toler0.1ances |
Mechanical Properties
| Temper | JIS Temper |
Tensile Strength Rm/N/mm2 |
Elongation A50/% |
Hardness HV |
M |
O |
350~410 |
25 |
80~120 |
Y4 |
1/4H |
375~445 |
15 |
105~145 |
Y2 |
1/2H |
385~460 |
12 |
120~165 |
Y |
H |
450~510 |
5 |
135~185 |
Note: We can provide products with other properties according to customers` requirements.
Application:
High precision radiator foil is main material in manufacturing automobile, farmer machine, mining machinery, engineering machinery, diesel locomotive, shipbuilding, generator set.
Carried Standard(Latest)
| Nations | Standard No. |
Standard Name |
China |
GB/T2059--2000 |
CHINA'S NATIONAL STANDARD |
Japan |
JIS H3100:2000 |
COPPER and COPPER ALLOY SHEETS,PLATES and STRIPS |
U.S.A |
ASTM B36/B 36M -01 |
STANDARD SPECIFICATION for BRASS,PLATE,SHEET,STRIP AND ROLLED BAR |
Germany |
DIN-EN 1652:1997 |
COPPER and COPPER ALLOYS PLATE,SHEET,STRIP and CIRCLES for GENERAL PURPOSES |
DIN-EN 1758:1997 |
COPPER and COPPER ALLOYS STRIP for LEADFRAMES | |
SEMI |
SEMI G4-0302 |
SPECIFICATION for INTERGRATED CIRCUIT LEADFRAME MATERIALS USED IN the PRODUCTION of STAMPED LEADFRAMES |
