| Surface Finishing: | Immersion Gold |
|---|---|
| Board Thickness: | 1.94mm |
| Copper Thickness: | 1.0 oz |
| Base Material: | RO4003C, RO4450F |
| Brand Name: | Bicheng Enterprise Limited |
| Min. Line Spacing: | 6 mil |
| Min. Line Width: | 6 mil |
| Min. Hole Size: | 0.4mm |
| Model Number: | BIC-056-V56 |
| Place of Origin: | China (Mainland) |
| Solder Mask Color: | Green |
| Colour of Component Legend: | White |
| TEST: | 100% Electrical Test prior shipment |
Quick Details
Specifications
Brief Introduction
RO4003C High Frequency Circuit Material is glass reinforced hydrocarbon/ceramic laminates
(Not PTFE) designed for performance sensitive, high volume commercial applications. Double
Sided and multilayer RO4003C PCB and hybrid RO4003C PCB are available at Bicheng company
at present. Double sided RO4003c PCB with thickness 12mil (0.305mm), 20mil (0.508mm) and
32mil (0.813mm) are the bestsellers. We provide prototype runs, small batches and volume
Production services.
Advantages
1) Excellent high frequency performance due to low dielectric tolerance and loss;
2) Excellent dimensional stability.
3) Low thermal coefficient of dielectric constant;
4) Low Z-Axis expansion;
5) Low in-plane expansion coefficient;
6) Stable electrical properties verus frequency;
Applications
1) Attenuator, Automatic gate induction;
2) LNB's for direct broadcast satellites;
3) Microstrip antenna, spread spectrum;
4) Microstrip and cellular base station antennas and power amplifiers;
5) RF identifications tags
6) Spread spectrum communications systems
7) Trunk amplifier, splitter module etc.
PCB Case: 6 Layer PCB Built on RO4003C (20mil) +
RO4450F Bondply with Immersion Gold
(Printed circuit boards are custom-made products, the picture and parameters shown are
Just for reference)
General description
this is a type of 6 layer high frequency PCB built on 20mil RO4003C with bondply RO4450F
for the application of radar altimeter. High frequency multilayer PCB has different stackup
from epoxy PCB (FR-4). for this 6 layer PCB, it uses 3 core of RO4003C for its construction.
the prepreg that matches is RO4450F, instead of the usual PP used in FR-4 PCB.
Basic specifications
Base material: RO4003C 0.508 mm + RO4450F 0.101mm
Layer count: 6 layers
Type: 1 PCB up per panel with v-cut
Format: 129mm x 75mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 m/ Inner layer 35 m
Solder mask / Legend: Green / White
Final PCB height: 1.94 mm
Standard: IPC 6012 Class 2
Packing: 20 panels are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months
Features and benefits
RO4003C exhibits a stable dielectric constant over a broad frequency range. this makes
It an ideal substrate for broadband applications;
Reducing signal loss in high frequency application meets the development needs of
Communication technology;
Excellent high frequency performance due to low dielectric tolerance and loss;
AOI inspection;
UL, ISO14001, TS16949 certified;
16000 square meter workshop;
More than 15 years of PCB experience;
Delivery on time: >98%
Customer complaint rate: <1%
Application
Satellite antenna, Power splitter, Radio frequency, Power divider
Parameter and data sheet
Variety of PCBs
High speed flying Test
RO4003C High Frequency Circuit Material is glass reinforced hydrocarbon/ceramic laminates
(Not PTFE) designed for performance sensitive, high volume commercial applications. Double
Sided and multilayer RO4003C PCB and hybrid RO4003C PCB are available at Bicheng company
at present. Double sided RO4003c PCB with thickness 12mil (0.305mm), 20mil (0.508mm) and
32mil (0.813mm) are the bestsellers. We provide prototype runs, small batches and volume
Production services.
Advantages
1) Excellent high frequency performance due to low dielectric tolerance and loss;
2) Excellent dimensional stability.
3) Low thermal coefficient of dielectric constant;
4) Low Z-Axis expansion;
5) Low in-plane expansion coefficient;
6) Stable electrical properties verus frequency;
Applications
1) Attenuator, Automatic gate induction;
2) LNB's for direct broadcast satellites;
3) Microstrip antenna, spread spectrum;
4) Microstrip and cellular base station antennas and power amplifiers;
5) RF identifications tags
6) Spread spectrum communications systems
7) Trunk amplifier, splitter module etc.
PCB Case: 6 Layer PCB Built on RO4003C (20mil) +
RO4450F Bondply with Immersion Gold
(Printed circuit boards are custom-made products, the picture and parameters shown are
Just for reference)
General description
this is a type of 6 layer high frequency PCB built on 20mil RO4003C with bondply RO4450F
for the application of radar altimeter. High frequency multilayer PCB has different stackup
from epoxy PCB (FR-4). for this 6 layer PCB, it uses 3 core of RO4003C for its construction.
the prepreg that matches is RO4450F, instead of the usual PP used in FR-4 PCB.
Basic specifications
Base material: RO4003C 0.508 mm + RO4450F 0.101mm
Layer count: 6 layers
Type: 1 PCB up per panel with v-cut
Format: 129mm x 75mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 m/ Inner layer 35 m
Solder mask / Legend: Green / White
Final PCB height: 1.94 mm
Standard: IPC 6012 Class 2
Packing: 20 panels are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months
Features and benefits
RO4003C exhibits a stable dielectric constant over a broad frequency range. this makes
It an ideal substrate for broadband applications;
Reducing signal loss in high frequency application meets the development needs of
Communication technology;
Excellent high frequency performance due to low dielectric tolerance and loss;
AOI inspection;
UL, ISO14001, TS16949 certified;
16000 square meter workshop;
More than 15 years of PCB experience;
Delivery on time: >98%
Customer complaint rate: <1%
Application
Satellite antenna, Power splitter, Radio frequency, Power divider
Parameter and data sheet
| PCB SIZE | 129 x 75mm=1PCS |
| BOARD TYPE | Multilayer PCB |
| Number of Layers | 6 layers |
| Surface Mount Components | YES |
| through Hole Components | YES |
| LAYER STACKUP | Copper --------35m (1 oz)+plate TOP layer |
| RO4003C 0.508mm | |
| Copper ------- 35m(1 oz) | |
| Prepreg RO4450F 0.101mm | |
| Copper ------- 35m (1 oz) | |
| RO4003C 0.508mm | |
| Copper ------- 35m (1 oz) | |
| Prepreg RO4450F 0.101mm | |
| Copper ------- 35m (1 oz) | |
| RO4003C 0.508mm | |
| Copper --------35m (1 oz)+plate BOT layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 6mil / 6 mil |
| Minimum / Maximum Holes: | 0.4 mm / 3.5 mm |
| Number of Different Holes: | 15 |
| Number of Drill Holes: | 324 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | RO4003C, RO4450F, Tg280, er<3.48, Rogers Corp. |
| Final foil external: | 1 oz |
| Final foil internal: | 1 oz |
| Final height of PCB: | 1.94 mm 10% |
| PLATING and COATING | |
| Surface Finish | Immersion gold 0.05 micron over nickle 4.4 micron |
| Solder Mask Apply to: | Top and Bottom sides |
| Solder Mask Color: | Green |
| Solder Mask Type: | LPI |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | Top and Bottom sides |
| Colour of Component Legend | White |
| Manufacturer Name or Logo: | Taiyo |
| VIA | Plated through hole(PTH), minimum size 0.4mm. No blind via or buried vias |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE of ARTWORK to BE SUPPLIED | Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Variety of PCBs
High speed flying Test