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Quick Details

Surface Finishing: Immersion Gold
Board Thickness: 1.6mm
Copper Thickness: 2.0 oz
Base Material: RO4003C mixed with FR-4
Brand Name: Bicheng Enterprise Limited
Min. Line Spacing: 5.5 mil
Min. Line Width: 7.2 mil
Min. Hole Size: 0.4mm
Model Number: BIC-059-V59
Place of Origin: China (Mainland)
Solder Mask Color: Green
Colour of Component Legend: White
TEST: 100% Electrical Test prior shipment

Specifications

Brief Introduction
with the development of electronic communication technology, the communication frequency
Is becoming higher and higher, and the high frequency signal transmission, need to use low
Dielectric constant (Dk), low dielectric loss (Df) but expensive special materials. these materials
Have cyanate and high frequency materials such as polytetrafluoroethylene / ceramic based
Materials (PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic).
Usually these materials are expensive. 
Reducing the cost is an important means for customers to improve the competitiveness of
Products. Therefore, the customers adopt the laminated structure of mixed materials in the
Design of PCB structure, that is, the necessary signal layer uses high-frequency materials to
Meet the needs of signal transmission. Other line layers are made of conventional fiberglass
Epoxy FR-4, which we call a hybrid board.


Available high frequency material (Core)
RO4350BRO4003C
4mil (0.1mm)8mil (0.203mm)
6.6mil (0.168mm)12mil (0.3mm)
10mil (0.254mm)20mil (0.508mm)
13.3mil (0.338mm)32mil (0.813mm)
20mil (0.508mm)60mil (1.524mm)
30mil (0.762mm)
60mil (1.524mm)


PCB Case: 4 Layer Mixed PCB on RO4350B 0.508 mm
+ FR4 0.60 mm with Immersion Gold

(Printed circuit boards are custom-made products, the picture and parameters shown are
Just for reference)


General description
this is a type of 4 Layer PCB mixed 0.508mm (20 mil) RO4350B and 0.6mm FR-4 for the
Application of Low Noise Amplifier. It's multiblock construction, so there're few different
Boards inside. Keep out lines are outer contour of the milling cutter. When you have several
Different prototype PCB jobs for trial market, this is a good economical way to help you save
the production cost that is merging these different PCBs together to be manufactured
Simultaneously on one panel. Finished PCB products can be formed in panel with breakouts
and can be individual boards too.


Basic specifications
Base material: RO4350B 0.508 mm + FR4 0.6 mm + PP 0.306 mm
Layer count: 4 layers
Type: Mixed multiblock milled with bridges
Format: 125mm x 82mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 70 um/ Inner layer 35 um
Solder mask / Legend: green / white
Final PCB height: 1.6 mm
Standard: IPC 6012 Class 2
Packing: 20 panels are packed for shipment. 
Lead time: 10 working days
Shelf life: 6 months


Features and benefits
the temperature coefficient of dielectric constant is among the lowest of any circuit board
Material, making it ideal for temperature sensitive applications;

RO4350B exhibits a stable dielectric constant over a broad frequency range. this makes
It an ideal substrate for broadband applications;

SI performance improvement over the stack-UPS with all FR4 board;
Cost reduction over stack-UPS with all low loss material;
AOI inspection;
More than 15 years of PCB experience;
ISO9001, ISO14001, TS16949, UL Certified;
Prototype to mass production capability;

Application
Mixer, Radar data acquisition converter, Spread spectrum, Duplexer


Parameter and data sheet
PCB SIZE 125mm x 82mm = 1 type = 1 piece
BOARD TYPE Multlayer PCB
Number of Layers 4 Layers
Surface Mount Components YES
through Hole Components YES
LAYER STACKUP Copper -----Top Layer 0.070mm (2 oz)
RO4350B 0.508 mm
Copper -----Plain 0.035 mm
Prepreg 2113 X 3, 0.306mm
Copper -----Plain 0.035 mm
FR-4 0.6mm
Copper ------- Bottom Layer 0.070mm (2oz)
TECHNOLOGY
Minimum Trace and Space: 5.5 mil / 7.2 mil
Minimum / Maximum Holes: 0.4 mm / 5.7 mm
Number of Different Holes: 15
Number of Drill Holes: 172
Number of Milled Slots: 0
Number of Internal Cutouts: NA
Impedance Control: N/A
Number of Gold finger: N/A
BOARD MATERIAL
Glass Epoxy:  RO4350B Tg280, er<3.48, Rogers Corp.; FR-4 IT158, ITEQ
Final foil external:  2.0 oz
Final foil internal:  1.0 oz
Final height of PCB:  1.6 mm 10%
PLATING and COATING
Surface Finish Immersion Gold
Solder Mask Apply to:  both Top and Bottom sides
Solder Mask Color:  Green
Solder Mask Type: LPI, Taiyo PSR-2000GT600D
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend Top and bottom side
Colour of Component Legend White, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo:  Marked on the board in a conductor and leged
FREE AREA
VIA Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:   0.0059"
Board plating: 0.0029"
Drill tolerance:  0.002"
TEST 100% Electrical Test prior shipment
TYPE of ARTWORK to BE SUPPLIED Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.


Variety of PCBs
4 Layer Mixed PCB On RO4350B 0508 mm FR4 060 mm with Immersion Gold

Peeling strength tester
4 Layer Mixed PCB On RO4350B 0508 mm FR4 060 mm with Immersion Gold