| Surface Finishing: | Immersion Gold |
|---|---|
| Board Thickness: | 1.0mm |
| Copper Thickness: | 1.0 oz |
| Base Material: | RO4003C mixed with FR-4 |
| Brand Name: | Bicheng Enterprise Limited |
| Min. Line Spacing: | 5 mil |
| Min. Line Width: | 5 mil |
| Min. Hole Size: | 0.4mm |
| Number of Layers: | |
| Model Number: | BIC-074-V74 |
| Place of Origin: | China (Mainland) |
| Solder Mask Color: | Green |
| Colour of Component Legend: | White |
| TEST: | 100% Electrical Test prior shipment |
Quick Details
Specifications
Brief Introduction
with the development of electronic communication technology, the communication frequency
Is becoming higher and higher, and the high frequency signal transmission, need to use low
Dielectric constant (Dk), low dielectric loss (Df) but expensive special materials. these materials
Have cyanate and high frequency materials such as polytetrafluoroethylene / ceramic based
Materials (PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic).
Usually these materials are expensive.
Reducing the cost is an important means for customers to improve the competitiveness of
Products. Therefore, the customers adopt the laminated structure of mixed materials in the
Design of PCB structure, that is, the necessary signal layer uses high-frequency materials to
Meet the needs of signal transmission. Other line layers are made of conventional fiberglass
Epoxy FR-4, which named a hybrid board.
Available high frequency material (Core)
RO4350BRO4003C
4mil (0.1mm)8mil (0.203mm)
6.6mil (0.168mm)12mil (0.3mm)
10mil (0.254mm)20mil (0.508mm)
13.3mil (0.338mm)32mil (0.813mm)
20mil (0.508mm)60mil (1.524mm)
30mil (0.762mm)
60mil (1.524mm)
PCB Case: 5 Layer PCB Built on Mixed RO4350B and
FR-4 at 1.0mm Thick with ENIG
(Printed circuit boards are custom-made products, the picture and parameters shown are
Just for reference)
General description
this is a type of 5 layer PCB built on mixed RF material RO4350B and textolite FR-4 for the
Application of 2.4 Ghz Antenna. It's 1.0 mm thick with through holes. Green solder mask
Covers both sides and immersion gold on pads. the base material is used from ITEQ and
Rogers, entire board supplying 1 PCB up. They're fabricated per IPC 6012 Class 2 using
Supplied Gerber data. Each 25 boards are packed for shipment.
Features and benefits
SI performance improvement over the stack-UPS with all FR4 board;
High solderability, no stressing of circuit boards and less contamination of PCB surface;
30000 square meter month capability;
8000 types of PCB per month;
Quick CADCAM checking and free PCB quotation;
No MOQ, low cost for prototypes and small runs quantity;
Delivery on time: >98%
IPC Class 2 / IPC Class 3;
Application
Consumer Electronics,Antena WiFi,8 Port Switch,Layer 3 Switch,Embedded Computer
DC Transformer,Inverter Auto,WiFi 3G Router,Temperature Module,Coffee makers
Parameter and data sheet
Variety of PCBs
High speed flying Test
with the development of electronic communication technology, the communication frequency
Is becoming higher and higher, and the high frequency signal transmission, need to use low
Dielectric constant (Dk), low dielectric loss (Df) but expensive special materials. these materials
Have cyanate and high frequency materials such as polytetrafluoroethylene / ceramic based
Materials (PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic).
Usually these materials are expensive.
Reducing the cost is an important means for customers to improve the competitiveness of
Products. Therefore, the customers adopt the laminated structure of mixed materials in the
Design of PCB structure, that is, the necessary signal layer uses high-frequency materials to
Meet the needs of signal transmission. Other line layers are made of conventional fiberglass
Epoxy FR-4, which named a hybrid board.
Available high frequency material (Core)
RO4350BRO4003C
4mil (0.1mm)8mil (0.203mm)
6.6mil (0.168mm)12mil (0.3mm)
10mil (0.254mm)20mil (0.508mm)
13.3mil (0.338mm)32mil (0.813mm)
20mil (0.508mm)60mil (1.524mm)
30mil (0.762mm)
60mil (1.524mm)
PCB Case: 5 Layer PCB Built on Mixed RO4350B and
FR-4 at 1.0mm Thick with ENIG
(Printed circuit boards are custom-made products, the picture and parameters shown are
Just for reference)
General description
this is a type of 5 layer PCB built on mixed RF material RO4350B and textolite FR-4 for the
Application of 2.4 Ghz Antenna. It's 1.0 mm thick with through holes. Green solder mask
Covers both sides and immersion gold on pads. the base material is used from ITEQ and
Rogers, entire board supplying 1 PCB up. They're fabricated per IPC 6012 Class 2 using
Supplied Gerber data. Each 25 boards are packed for shipment.
Features and benefits
SI performance improvement over the stack-UPS with all FR4 board;
High solderability, no stressing of circuit boards and less contamination of PCB surface;
30000 square meter month capability;
8000 types of PCB per month;
Quick CADCAM checking and free PCB quotation;
No MOQ, low cost for prototypes and small runs quantity;
Delivery on time: >98%
IPC Class 2 / IPC Class 3;
Application
Consumer Electronics,Antena WiFi,8 Port Switch,Layer 3 Switch,Embedded Computer
DC Transformer,Inverter Auto,WiFi 3G Router,Temperature Module,Coffee makers
Parameter and data sheet
| PCB SIZE | 159.12 x 39.78mm=1PCS |
| BOARD TYPE | Hybrid Multilayer PCB |
| Number of Layers | 5 layers |
| Surface Mount Components | YES |
| through Hole Components | YES |
| LAYER STACKUP | Copper ------- 18um(0.5oz)+plate TOP layer |
| RO4350B 10 mil (0.254mm) | |
| Prepreg 0.12mm | |
| Copper ------- 35um(1oz) MidLayer 1 | |
| FR-4 0.152mm | |
| Copper ------- 35um(1oz) MidLayer 2 | |
| Prepreg 0.12mm | |
| Copper ------- 35um(1oz) MidLayer 3 | |
| FR-4 0.152mm | |
| Copper ------- 18um(0.5oz)+plate BOT layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5 mil / 5 mil |
| Minimum / Maximum Holes: | 0.4 mm / 5.0 mm |
| Number of Different Holes: | 7 |
| Number of Drill Holes: | 81 |
| Number of Milled Slots: | 2 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4 Tg130, er<5.4; RO4350B Tg280, er < 3.8 |
| Final foil external: | 1 oz |
| Final foil internal: | 1 oz |
| Final height of PCB: | 1.0 mm 0.1 |
| PLATING and COATING | |
| Surface Finish | Immersion gold (14.6% ) 0.05m over 3m nickel |
| Solder Mask Apply to: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, PSR-2000GT600D, Taiyo Supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | CNC Routing |
| MARKING | |
| Side of Component Legend | TOP and Bottom. |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo brand |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through hole(PTH), minimum size 0.4mm. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE of ARTWORK to BE SUPPLIED | Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Variety of PCBs
High speed flying Test