Brief Introduction
with the development of electronic communication technology, the communication frequency
Is becoming higher and higher, and the high frequency signal transmission, need to use low
Dielectric constant (Dk), low dielectric loss (Df) but expensive special materials. these materials
Have cyanate and high frequency materials such as polytetrafluoroethylene / ceramic based
Materials (PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic).
Usually these materials are expensive. 
Reducing the cost is an important means for customers to improve the competitiveness of
Products. Therefore, the customers adopt the laminated structure of mixed materials in the
Design of PCB structure, that is, the necessary signal layer uses high-frequency materials to
Meet the needs of signal transmission. Other line layers are made of conventional fiberglass
Epoxy FR-4, which we call a hybrid board.

Available high frequency material (Core)
RO4350BRO4003C
4mil (0.1mm)8mil (0.203mm)
6.6mil (0.168mm)12mil (0.3mm)
10mil (0.254mm)20mil (0.508mm)
13.3mil (0.338mm)32mil (0.813mm)
20mil (0.508mm)60mil (1.524mm)
30mil (0.762mm)
60mil (1.524mm)



PCB Case: Hybrid PCB Built on 20mil RO4350B and
FR4 with Immersion Silver
(PCB's are custom-made products, the picture and parameters shown are just for reference)


General description
this is a type of mixed PCB built on 20mil RO4350B substrate and FR-4 combined for the
Application of Wireless Range Extender. It's also an impedance controlled board. 50 ohm
Single end impedance is controlled on top layer and bottom layer. It's 1.8 mm thick with
4 layers copper of 2oz weight, white silkscreen on blue solder mask and immersion silver
on pads. the base material is from Rogers Corp supplying single up PCB per panel. They're
Fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for
Shipment. 

Features and benefits
RO4350B exhibits a stable dielectric constant over a broad frequency range. this
Makes it an ideal substrate for broadband applications;
Good high temperature and low temperature resistance(-192-260);
Superior corrosion resistance;
SI performance improvement over the stack-UPS with all FR4 board;
8000 types of PCB per month;
Quick CADCAM checking and free PCB quotation;
Professional and experienced engineers;
Competitive price.


Application
Antenna,Antenna combiner,Balanced amplifier,3G antenna


Parameter and data sheet

PCB SIZE	72 x 36.1 mm=1PCS
BOARD TYPE	Hybrid PCB
Number of Layers	Multilayer PCB, 4 layer PCB
Surface Mount Components	YES
through Hole Components	NO
LAYER STACKUP	Copper ------- 52um(1.5 oz)+plate TOP layer
	RO4350B 0.508mm (20 mil)
	Copper ------- 70um(2 oz) MidLayer 1
	FR-4 0.48 mm
	Copper ------- 70um(2 oz) MidLayer 2
	FR-4 0.48 mm
	Copper ------- 52um(1.5 oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	5 mil / 6 mil
Minimum / Maximum Holes:	0.4 /4.5 mm
Number of Different Holes:	10
Number of Drill Holes:	32
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	YES. Top layer, single end impedance 41.34 mil 50 ohm;Bottom layer, Single end impedance 35.43 mil 50 ohm.
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	RO4350B 0.508 mm (20 mil) and FR-4 0.48 mm combined
Final foil external:	2 oz
Final foil internal:	2 oz
Final height of PCB:	1.8mm 0.18
PLATING and COATING
Surface Finish	Immersion Silver
Solder Mask Apply to:	both sides
Solder Mask Color:	Blue, KSM-6189BL04/KSM-19H01
Solder Mask Type:	LPI
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	NO
Colour of Component Legend	NO
Manufacturer Name or Logo:	NO
VIA	Plated through hole(PTH), Blind via L2-L4, L3-L4
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
TYPE of ARTWORK to BE SUPPLIED	Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Variety of PCBs


FPC laser cut