Brief Introduction
with the development of electronic communication technology, the communication frequency
Is becoming higher and higher, and the high frequency signal transmission, need to use low
Dielectric constant (Dk), low dielectric loss (Df) but expensive special materials. these materials
Have cyanate and high frequency materials such as polytetrafluoroethylene / ceramic based
Materials (PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic).
Usually these materials are expensive. 
Reducing the cost is an important means for customers to improve the competitiveness of
Products. Therefore, the customers adopt the laminated structure of mixed materials in the
Design of PCB structure, that is, the necessary signal layer uses high-frequency materials to
Meet the needs of signal transmission. Other line layers are made of conventional fiberglass
Epoxy FR-4, which we call a hybrid board.

Available high frequency material (Core)
RO4350BRO4003C
4mil (0.1mm)8mil (0.203mm)
6.6mil (0.168mm)12mil (0.3mm)
10mil (0.254mm)20mil (0.508mm)
13.3mil (0.338mm)32mil (0.813mm)
20mil (0.508mm)60mil (1.524mm)
30mil (0.762mm)
60mil (1.524mm)



PCB Case: Hybrid PCB Built on 10mil RO4003C and
FR-4 Combined with Immersion Silver
(PCB's are custom-made products, the picture and parameters shown are just for
Reference)


General description
this is a type of mixed PCB built on 10mil RO4003C substrate and FR-4 combined for
the application of SMS Gateway. It's 1.12 mm thick with 4 layers copper of 1oz weight
Each layer, white silkscreen on blue solder mask and immersion silver on pads. the base
Material is from Rogers Corp supplying single up PCB per panel. They're fabricated per
IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment. 

Features and benefits
RO4003C exhibits a stable dielectric constant over a broad frequency range. this
Makes it an ideal substrate for broadband applications;
Reducing signal loss in high frequency application meets the development needs of
Communication technology;
Cost reduction over stack-UPS with all low loss material;
AOI inspection;
Electrical test and high voltage test;
Wide range of PCB supplying;
UL recognized and RoHS Directive-compliant;
IPC Class 2 / IPC Class 3.

Application
Low noise amplifier,Optical coupler,Frequency converter,4G antenna

Parameter and data sheet

PCB SIZE	35 x 100mm=1PCS
BOARD TYPE	Multilayer PCB
Number of Layers	4 layers
Surface Mount Components	YES
through Hole Components	YES
LAYER STACKUP	Copper ------- 18um(0.5oz)+plate TOP layer
	RO4003C 0.254mm
	Copper ------- 35um(1oz) MidLayer 1
	FR-4 0.5mm
	Copper ------- 35um(1oz) MidLayer 2
	FR-4 0.2mm
	Copper ------- 18um(0.5oz)+plate BOT layer
TECHNOLOGY
Minimum Trace and Space:	9.8 mil / 7.8 mil
Minimum / Maximum Holes:	0.7 mm / 2.5 mm
Number of Different Holes:	3
Number of Drill Holes:	184
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	RO4003C Tg 280, er<3.38, FR-4 Tg 150
Final foil external:	1 oz
Final foil internal:	1 oz
Final height of PCB:	1.12 mm 0.1
PLATING and COATING
Surface Finish	Immersion silver
Solder Mask Apply to:	TOP and Bottom, 12micron Minimum
Solder Mask Color:	Blue, KSM-6189BL04/KSM-19H01
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	N/A
Colour of Component Legend	N/A
Manufacturer Name or Logo:	N/A
VIA	Plated through hole(PTH), minimum size 0.7mm.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE of ARTWORK to BE SUPPLIED	Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Variety of PCBs


Heavy copper tester