Brief Introduction
with the development of electronic communication technology, the communication frequency
Is becoming higher and higher, and the high frequency signal transmission, need to use low
Dielectric constant (Dk), low dielectric loss (Df) but expensive special materials. these materials
Have cyanate and high frequency materials such as polytetrafluoroethylene / ceramic based
Materials (PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic).
Usually these materials are expensive. 
Reducing the cost is an important means for customers to improve the competitiveness of
Products. Therefore, the customers adopt the laminated structure of mixed materials in the
Design of PCB structure, that is, the necessary signal layer uses high-frequency materials to
Meet the needs of signal transmission. Other line layers are made of conventional fiberglass
Epoxy FR-4, which we call a hybrid board.

Available high frequency material (Core)
RO4350BRO4003C
4mil (0.1mm)8mil (0.203mm)
6.6mil (0.168mm)12mil (0.3mm)
10mil (0.254mm)20mil (0.508mm)
13.3mil (0.338mm)32mil (0.813mm)
20mil (0.508mm)60mil (1.524mm)
30mil (0.762mm)
60mil (1.524mm)



PCB Case: Hybrid PCB Built on 8 mil RO4003C and
FR4 with Immersion Silver and Blue Color
(PCB's are custom-made products, the picture and parameters shown are just for
Reference)


General description
this is a type of 4 layer hybrid PCB built on 0.203mm RO4003C and FR-4 substrate with
Tg 280C for the application of Radio Frequency. It's 1.1 mm thick without silkscreen on
Blue solder mask (Kuangshun) and immersion silver on pads. the base material is from
Rogers and ITEQ supplying single up PCB. They're fabricated per IPC 6012 Class 2 using
Supplied Gerber data. Each 25 boards are packed for shipment. 

Features and benefits
RO4003C exhibit a stable dielectric constant over a broad frequency range. this
Makes it an ideal substrate for broadband applications.
SI performance improvement over the stack-UPS with all FR4 board 
Excellent dimensional stability.
Environmental-friendly surface treatment and mature technology.
Thermal stress test, reliability test, insulation resistance test and ionic contamination
Test
Comprehensive equipment management and maintenance and process control 
1-10 pieces are offered
Delivery on time: >98%  
Experienced sales persons provide skilled customer services.


Application
RF transceiverPower dividerLNBAttenuator   Directional coupler Photocoupler


Parameter and data sheet

PCB SIZE	140 x 35 mm=1PCS
BOARD TYPE	Multilayer PCB
Number of Layers	4 layers
Surface Mount Components	YES
through Hole Components	YES
LAYER STACKUP	Copper ------- 35um TOP layer
	RO4003C 0.203mm
	Copper ------- 35um(1oz) MidLayer 1
	FR-4 0.5mm
	Copper ------- 35um(1oz) MidLayer 2
	FR-4 0.2mm
	Copper ------- 35um BOT layer
TECHNOLOGY
Minimum Trace and Space:	7.8 mil / 4.4 mil
Minimum / Maximum Holes:	0.3 mm / 2.5  mm
Number of Different Holes:	4
Number of Drill Holes:	91
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	Rogers RO4003C +FR4 hybrid material
Final foil external:	1 oz
Final foil internal:	1 oz
Final height of PCB:	1.1 mm 0.11
PLATING and COATING
Surface Finish	Immersion silver
Solder Mask Apply to:	TOP and Bottom, 12micron Minimum
Solder Mask Color:	Blue, KSM-6189BL04/KSM-19H01
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	NO
Colour of Component Legend	NO
Manufacturer Name or Logo:	NO
VIA	Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE of ARTWORK to BE SUPPLIED	Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Variety of PCBs


High speed flying Test