Brief Introduction
RO4350B High Frequency Circuit Material is glass reinforced hydrocarbon/ceramic laminates
(Not PTFE) designed for performance sensitive, high volume commercial applications. Currently
Double sided and multilayer RO4350B PCB's are available at Bicheng company. Double sided
RO4350B PCB with thickness 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm) and 60mil
(1.524mm) are the bestsellers. We provide prototype runs, small batches and volume production
Services.

Advantages
1) Excellent high frequency performance due to low dielectric tolerance and loss;
2) Excellent dimensional stability.
3) Low thermal coefficient of dielectric constant;
4) Low Z-Axis expansion;
5) Low in-plane expansion coefficient;
6) Stable electrical properties verus frequency;

Applications
1) Attenuator, Automatic gate induction;
2) LNB's for direct broadcast satellites;
3) Microstrip antenna, spread spectrum;
4) Microstrip and cellular base station antennas and power amplifiers;
5) RF identifications tags
6) Spread spectrum communications systems
7) Trunk amplifier, splitter module etc.


PCB Case: Multilayer PCB Built on RO4350B with
Blind Via from Top to Inner Layer
(PCB's are custom-made products, the picture and parameters shown are just for
Reference)


General Description
this is a type of 4 layer HDI high frequency multilayer PCB built on RO4350B with RO4450B
Prepreg for the application of radar RF board. It's 1.0 mm thick with white silkscreen (Taiyo)
on green solder mask (Taiyo) and immersion gold on pads. this board contains blind via from
Top layer to inner 1, top layer to inner 3. since it's asymmetric buildup,1.2% warpage is allowed.
It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 boards are packed for
Shipment. 


Features and benefits
the temperature coefficient of dielectric constant is among the lowest of any circuit
Board material, making it ideal for temperature sensitive applications.
Reducing signal loss in high frequency application meets the development needs of
Communication technology.
Excellent high frequency performance due to low dielectric tolerance and loss.
Gold has high solderability, no stressing of circuit boards and less contamination of
PCB surface.
Engineering design prevents problems from occurring in pre-production. 
100% tests inclusive of electrical test and AOI inspection.
Fast and flexible to save the time of production from prototype to standard production
Great customer service
UL recognized and RoHS Directive-compliant


Application
RF module, Power splitter, Low Noise Block, 3G antenna


Parameter and data sheet