Structure of FPC
According to the number of layers of conductive copper foil, FPC can be divided into single
Layer circuit, double layer circuit, multi-layer circuit, double sided and so on. 

Single-layer structure: the flexible circuit of this structure is the simplest structure of the
Flexible PCB. Usually the base material (dielectric substrates) + transparent rubber(adhesive)
+ copper foil is a set of purchased raw materials(semi-manufactures), the protective film and
Transparent glue are another kind of bought raw material. First, copper foil must be etched to
Obtain the required circuit, and the protective film should be drilled to reveal the corresponding
Pad. after cleaning, the two are combined by rolling. Then the exposed part of the pad
Electroplated gold or tin to protect. In this way, the big panel board will be ready. Generally
Also it's stamped into the corresponding shape of the small circuit board. There is also no
Protective film directly on the copper foil, but printed resistance soldering coating, so that the
Cost will be lower, but the mechanical strength of the circuit board will become worse. unless
the strength requirement is not high and the price needs to be as low as possible, it is best to
Apply the protective film method. 

Double layer structure: when the circuit is too complex to be wired, or copper foil is needed
to shield the ground, it is necessary to choose a double layer or even a multilayer. the most
Typical difference between a multilayer and a single plate is the addition of a perforated structure
to connect the layers of copper foil. the first process of transparent rubber + base material +
Copper foil is to make holes. Drill holes in the base material and copper foil first, clean and
Then plated with a certain thickness of copper. The subsequent fabrication process is almost
the same as the single-layer circuit. 

Double sided structure: both sides of the double sided FPC have pads, mainly used to connect
Other circuit boards. Although it and monolayer structure is similar, but the manufacturing
Process is very different. Its raw material is copper foil, protective film and transparent glue.
the protective film should be drilled according to the position of the pad first, then the copper
Foil should be affixed, the pad and track lines should be etched and then the protective film of
Another drilled hole should be affixed.



FPC Case: 4-Layer Flexible Printed Circuit FPC Built on
Polyimide with Black Mask
(Flexible printed circuits are custom-made products, the picture and parameters shown are
Just for reference)


General description
this is a type of flexible printed circuit for the application of PLC Programing It's a 4 layer
FPC at 0.3mm thick. the base laminate is from ITEQ, It's fabricated per IPC 6012 Class 2
Using supplied Gerber data. Polyimide stiffener is applied on the inserting part.

Parameter and data sheet

Size of Flexible PCB	70.18 X 40.28mm
Number of Layers	4
Board Type	Flexible PCB
Board Thickness	0.30mm
Board Material	Polyimide 25m
Board Material Supplier	ITEQ
Tg Value of Board Material	60
PTH Cu thickness	20 m
Inner Iayer Cu thicknes	N/A
Surface Cu thickness	35 m
Coverlay Colour	Black
Number of Coverlay	2
Thickness of Coverlay	25 m
Stiffener Material	Polyimide
Stiffener Thickness	0.2mm
Type of Silkscreen Ink	IJR-4000 MW300
Supplier of Silkscreen	TAIYO
Color of Silkscreen	White
Number of Silkscreen	1
Peeling test of Coverlay	No peelable
Legend Adhesion	3M 90 No peeling after Min. 3 times test
Surface Finish	Immersion Gold
Thickness of Nickle/Gold	Au: 0.03m(Min.); Ni 2-4m
RoHS Required	Yes
Famability	94-V0
Thermal Shock Test	Pass, -25125, 1000 cycles.
Thermal Stress	Pass, 3005,10 seconds, 3 cycles. No delamination, no Blistering.
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6013C Class 2

Features and benefits
Excellent flexibility
Reducing the volume
Weight reduction
Consistency of assembly
Increased reliability
Controllability of electrical parameter design
the end can be whole soldered
Material optionality
Low cost
Continuity of processing
Focus on low to medium volume production
Make delivery on time. We keep higher than 98% on-time-delivery rate.


Application
Keypad FPC, FFC for industrial control equipment, consumer game consoles


Variety of PCBs

LDI equipment