Clarifications of FPC
According to the combination of base material and copper foil, flexible circuit board can
Be divided into two types: flexible board with adhesive and flexible board without adhesive.
the price of non-adhesive flexible PCB is much higher than that of adhesive flexible PCB, but
Its flexibility, bonding force between copper foil and substrate and flatness of solder are also
Better than that of adhesive flexible PCB. so it is only used in the high demand situations,
Such as the: COF (CHIP on FLEX, flexible board with bare chip, the high flatness of the pad)
and so on. Because its price is high, most of the flexible PCBs used in the market are still
Adhesive flexible circuit board. Because the flexible circuit board is mainly used in the
Situation where bending is required, if the design or process is not reasonable, it is easy
to produce micro-cracks, welding and other defects.

Economy of using FPC
If the circuit design is relatively simple, the total volume is small, and the space is suitable,
the traditional internal connection is much cheaper. Flexible circuits are a good design option
If the circuit is complex, processes many signals or has special electrical or mechanical
Requirements. When the size and performance of applications exceed the capacity of rigid
Circuits, flexible assembly is the most economical. A 12mil pad with a 5mil through hole
and a flexible circuit with 3mil lines and spacing can be fabricated on a thin film. Therefore,
It is more reliable to mount the chip directly on the film. There is no flame retardant that
Could be an ion source. these films may be protective and solidified at higher temperatures
to obtain higher glass transition temperatures. Flexible materials are less costly than rigid
Materials because they are free of connectors.



FPC Case: FPC Board Single Sided Flexible PCB with
Immersion Gold Pads
(Flexible printed circuits are custom-made products, the picture and parameters shown
Are just for reference)

General description
this is a type of flexible printed circuit for the application of antenna. It's a single layer
Board at 0.15mm thick. the base laminate is from ITEQ, It's fabricated per IPC 6012
Class 2 using supplied Gerber data. 3M tape is applied on the back side, Polyimide as
Stiffener on the head.

Parameter and data sheet

Number of Layers	1
Board Type	Flexbile cirucit
Board Thickness	0.15mm +/-10%
Board Material	Polyimide (PI) 25um
Board Material Supplier	ITEQ
Tg Value of Board Material	60
PTH Cu thickness	N/A
Inner Iayer Cu thicknes	N/A
Surface Cu thickness	35 um (1oz)
Coverlay Colour	Yellow
Number of Coverlay	2
Thickness of Coverlay	25 um
Stiffener	Polyimide 0.3mm
Type of Silkscreen Ink	Taiyo
Supplier of Silkscreen	Taiyo
Color of Silkscreen	White
Number of Silkscreen	1
Mininum Trace (mil)	20 mil
Minimum Gap(mil)	N/A
Surface Finish	Immersion Gold
RoHS Required	Yes
Famability	94-V0
Thermal Shock Test	Pass, -25125, 1000 cycles.
Thermal Stress	Pass, 3005,10 seconds, 3 cycles. No delamination, no Blistering.
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6013C Class 2

Features and benefits
Excellent flexibility
Reducing the volume
Weight reduction
Consistency of assembly
Increased reliability
Controllability of electrical parameter design
the end can be whole soldered
Material optionality
Low cost
Continuity of processing
Competitive price
Quick Lead time: 3-5 days



Application
Thin-film switch,Medical keypad soft board


FPC

V-cut depth tester