Clarifications of FPC
According to the combination of base material and copper foil, flexible circuit board can
Be divided into two types: flexible board with adhesive and flexible board without adhesive.
the price of non-adhesive flexible PCB is much higher than that of adhesive flexible PCB,
but its flexibility, bonding force between copper foil and substrate and flatness of solder
Are also better than that of adhesive flexible PCB. So it is only used in the high demand
Situations, such as the: COF (CHIP ON FLEX, flexible board with bare chip, the high flatness
of the pad) and so on. Because its price is high, most of the flexible PCBs used in the market
Are still adhesive flexible circuit board. Because the flexible circuit board is mainly used in the
Situation where bending is required, if the design or process is not reasonable, it is easy to
Produce micro-cracks, welding and other defects.

Economy of using FPC
If the circuit design is relatively simple, the total volume is small, and the space is suitable,
the traditional internal connection is much cheaper. Flexible circuits are a good design option
If the circuit is complex, processes many signals or has special electrical or mechanical
Requirements. When the size and performance of applications exceed the capacity of rigid
Circuits, flexible assembly is the most economical. A 12mil pad with a 5mil through hole
and a flexible circuit with 3mil lines and spacing can be fabricated on a thin film. Therefore,
It is more reliable to mount the chip directly on the film. There is no flame retardant that
Could be an ion source. these films may be protective and solidified at higher temperatures
to obtain higher glass transition temperatures. Flexible materials are less costly than rigid
Materials because they are free of connectors.



FPC Case: 2 Layer Flexible PCB (FPC) Built on Polyimide
for Modem Wireless
(Flexible printed circuits are custom-made products, the picture and parameters shown are
Just for reference)

General description
this is a type of 2 Layer flexible printed circuit (FPC) built on polyimide for the application
of Modem Wireless.

Basic specifications
Base material: Polyimide 12.5m + 0.2mm polyimide stiffener.
Layer count: 2 layers
Type: Individual FPC
Format: 135mm x 82mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 m/ Inner layer 0 m
Solder mask / Legend: Yellow coverlay / white
Final PCB height: 0.15 mm
Standard: IPC 6012 Class 2
Packing: 100 pieces are packed for shipment. 
Lead time: 10 working days
Shelf life: 6 months

Features and benefits
Reducing the volume;
Consistency of assembly;
Controllability of electrical parameter design;
SMT process is resistant to reflow soldering, resistant to rework;
16000 square meter workshop;
Competitive price;
on-time service;
More than 15 years of PCB experience;

Application
Capacitive touch screen / panel, mobile phone antenna flex board, automobile GPS
Navigation flex board, contact belt of inkjet printerIndustrial control interphone,
Consumer card reader soft board.

General Properties of Single Sided FCCL

Test Item		Treatment Condition	Unit	Property Date
				IPC Standard * value	Typical Value
					SF201 0512SE	SF201 0518SR
Peel Strength (90)		A	N/mm	0.525	1.0	0.9
		288, 5s		0.525	1.0	0.9
Folding Endurance (MIT)		R0.8 X 4.9N	Times	-	10000	10000
Thermal Stress		288, 20s	-	-	No Delamination	No Delamination
Dimensional Stability	MD	E-0.5/150	%	0.2	0.1	0.1
	TD				0.1	0.1
Chemical Resistance		after Chemical Exposure	%	80	90	90
Dielectric Constant (1MHz)		C-24/23/50	-	4.0	3.2	3.2
Dissipation Factor (1MHz)		C-24/23/50	-	0.01	0.008	0.008
Volume Resistvitiy		C-96/35/90	M-cm	10^6	4.5 x 10^8	4.5 x 10^8
Surface Resistance		C-96/35/90	M	10^5	3.0 x 10^6	3.0 x 10^6

Explanations:
C = Humidity conditioning;
E = Temperature conditioning;
* Certified to IPC-4204/11 Copper Clad Adhesiveless Polyimide

Product Code Description
SF201 05 12 S E
SF201: Shengyi Adhesiveless FCCL Designation
05: PI Film Thickness, 05- 12.5m; 08-20m
12: Copper Foil Thickness, 12-12m, 18-18m
S: Single Sided
E- ED copper; R- RA Copper


FPC

X-ray target shooting