| Surface Finishing: | Immersion Gold |
|---|---|
| Board Thickness: | 0.20mm |
| Copper Thickness: | 35 um |
| Base Material: | Polyimide 25um |
| Brand Name: | Bicheng Enterprise Limited |
| Min. Line Spacing: | N/A |
| Min. Line Width: | N/A |
| Min. Hole Size: | N/A |
| Model Number: | BIC-305-V305 |
| Place of Origin: | China (Mainland) |
| Coverlay Colour: | Yellow |
| Color of Silkscreen: | White |
Quick Details
Specifications
Components of a flexible circuit
A flexible circuit consists of copper foil, dielectric substrate+ coverlay and adhesive.
Copper foil is available in two different types of copper: ED Copper and RA copper.
ED copper is an electro-deposited (ED) copper foil produced in the same way as the copper
Foil used for rigid printed circuit boards. this also means that the copper is " treated", i.e., it
Has a slightly rough surface on one side, which ensures a better adhesion when the copper
Foil is bonded to the base material.
RA copper is a rolled and annealed copper foil produced from electrolytically deposited cathode
Copper, which is melted and cast into ingots. the ingots are first hot-rolled to a certain size and
Milled on all surfaces. the copper is then cold-rolled and annealed, until the desired thickness is
Obtained.
Copper foil is available in thickness of 12, 18, 35 and 70 m.
the most common available for dielectric substrate and coverlay is polyimide films. this
Material can also be used as coverlay. Polyimide is best suited for flexible circuits because
of its characteristics as stated below:
High temperature resistance allows soldering operations without damaging the flexible
circuits
Very good electrical properties
Good chemical resistance
Polyimide is available in thicknesses of 12.5, 20, 25 and 50 m.
Base laminates for rigid printed circuit boards are copper foils laminated together with the
Base materials, the adhesive coming from the prepreg material during lamination. Contrary
to this is the flexible circuit where the lamination of the copper foil to the film material is
Achieved by means of an adhesive system. It is necessary to distinguish between two main
Systems of adhesive, namely thermoplastic and thermoset adhesives. The choice is dictated
Partly by the processing, and partly by the application of the finished flexible circuit.
FPC Case: 2 Layer flexible Printed Circuit Board (FPC)
Built on Polyimide for Embedded Operating System
(Flexible printed circuits are custom-made products, the picture and parameters shown are
Just for reference)
General description
this is a type of 2 Layer flexible printed circuit (FPC) built on polyimide for the application
of Embedded Operating System.
Basic specifications
Base material: Polyimide 25m + 0.3mm stiffener of FR-4
Layer count: 2 layers
Type: Individual FPC
Format: 130mm x 15mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 m/ Inner layer 0 m
Solder mask / Legend: Yellow coverlay / white
Final PCB height: 0.20 mm
Standard: IPC 6012 Class 2
Packing: 100 pieces are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months
Features and benefits
Excellent flexibility;
Reducing the volume;
Weight reduction;
Engineering design prevents problems from occurring in pre-production;
PCB manufacturing is strictly as per required specifications;
Great customer service;
Diversified shipping method: FedEx, DHL, TNT, EMS;
Prototype PCB capability;
Volume Production capability;
Application
Laser head FPC, Mobile phone battery flex board, medical keypad soft board,LCD
Module, Industrial control computer soft board, consumer ETC (Electronic Toll
Collection ) soft board
Specifications of Standard 1 Layer FCCL
Product Code Description
SF201 05 12 S E
SF201: Shengyi Adhesiveless FCCL Designation
05: PI Film Thickness, 05- 12.5m; 08-20m
12: Copper Foil Thickness, 12-12m, 18-18m
S: Single Sided
E- ED copper; R- RA Copper
FPC
Automated film-sticking machine
A flexible circuit consists of copper foil, dielectric substrate+ coverlay and adhesive.
Copper foil is available in two different types of copper: ED Copper and RA copper.
ED copper is an electro-deposited (ED) copper foil produced in the same way as the copper
Foil used for rigid printed circuit boards. this also means that the copper is " treated", i.e., it
Has a slightly rough surface on one side, which ensures a better adhesion when the copper
Foil is bonded to the base material.
RA copper is a rolled and annealed copper foil produced from electrolytically deposited cathode
Copper, which is melted and cast into ingots. the ingots are first hot-rolled to a certain size and
Milled on all surfaces. the copper is then cold-rolled and annealed, until the desired thickness is
Obtained.
Copper foil is available in thickness of 12, 18, 35 and 70 m.
the most common available for dielectric substrate and coverlay is polyimide films. this
Material can also be used as coverlay. Polyimide is best suited for flexible circuits because
of its characteristics as stated below:
High temperature resistance allows soldering operations without damaging the flexible
circuits
Very good electrical properties
Good chemical resistance
Polyimide is available in thicknesses of 12.5, 20, 25 and 50 m.
Base laminates for rigid printed circuit boards are copper foils laminated together with the
Base materials, the adhesive coming from the prepreg material during lamination. Contrary
to this is the flexible circuit where the lamination of the copper foil to the film material is
Achieved by means of an adhesive system. It is necessary to distinguish between two main
Systems of adhesive, namely thermoplastic and thermoset adhesives. The choice is dictated
Partly by the processing, and partly by the application of the finished flexible circuit.
FPC Case: 2 Layer flexible Printed Circuit Board (FPC)
Built on Polyimide for Embedded Operating System
(Flexible printed circuits are custom-made products, the picture and parameters shown are
Just for reference)
General description
this is a type of 2 Layer flexible printed circuit (FPC) built on polyimide for the application
of Embedded Operating System.
Basic specifications
Base material: Polyimide 25m + 0.3mm stiffener of FR-4
Layer count: 2 layers
Type: Individual FPC
Format: 130mm x 15mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 m/ Inner layer 0 m
Solder mask / Legend: Yellow coverlay / white
Final PCB height: 0.20 mm
Standard: IPC 6012 Class 2
Packing: 100 pieces are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months
Features and benefits
Excellent flexibility;
Reducing the volume;
Weight reduction;
Engineering design prevents problems from occurring in pre-production;
PCB manufacturing is strictly as per required specifications;
Great customer service;
Diversified shipping method: FedEx, DHL, TNT, EMS;
Prototype PCB capability;
Volume Production capability;
Application
Laser head FPC, Mobile phone battery flex board, medical keypad soft board,LCD
Module, Industrial control computer soft board, consumer ETC (Electronic Toll
Collection ) soft board
Specifications of Standard 1 Layer FCCL
| Specifications | Thickness (m) | Copper Type | Applications | |
| Polyimide Film | Copper Foil | |||
| SF201 0512SE | 12.5 | 12 | ED | Motor, digital products etc. as univeral connector |
| SF201 0812SE | 20 | 12 | ED | |
| SF201 1012SE | 25 | 12 | ED | |
| SD201 0518SE | 12.5 | 18 | ED | |
| SF201 0818SE | 20 | 18 | ED | |
| SF201 1018SE | 25 | 18 | ED | |
| SF201 0535SE | 12.5 | 35 | ED | Automotive electronics etc.. |
| SF201 0835SE | 20 | 35 | ED | |
| SF201 1035SE | 25 | 35 | ED | |
| SF201 1070SE | 25 | 70 | ED | |
| SF201 2070SE | 50 | 70 | ED | Motor, digital products etc.as Univeral connector |
| SF201 0512SR | 12.5 | 12 | RA | |
| SF201 0812SR | 20 | 12 | RA | |
| SF201 1012SR | 25 | 12 | RA | |
| SF201 0518SR | 12.5 | 18 | RA | |
| SF201 0818SR | 20 | 18 | RA | |
| SF201 1018SR | 25 | 18 | RA | |
Product Code Description
SF201 05 12 S E
SF201: Shengyi Adhesiveless FCCL Designation
05: PI Film Thickness, 05- 12.5m; 08-20m
12: Copper Foil Thickness, 12-12m, 18-18m
S: Single Sided
E- ED copper; R- RA Copper
FPC
Automated film-sticking machine