| Surface Finishing: | Immersion Gold |
|---|---|
| Board Thickness: | 0.15mm |
| Copper Thickness: | 35 um |
| Base Material: | Polyimide 25um |
| Brand Name: | Bicheng Enterprise Limited |
| Min. Line Spacing: | N/A |
| Min. Line Width: | N/A |
| Min. Hole Size: | N/A |
| Model Number: | BIC-311-V311 |
| Place of Origin: | China (Mainland) |
| Coverlay Colour: | Yellow |
| Color of Silkscreen: | N/A |
Quick Details
Specifications
Clarifications of FPC
According to the combination of base material and copper foil, flexible circuit board can
Be divided into two types: flexible board with adhesive and flexible board without adhesive.
the price of non-adhesive flexible PCB is much higher than that of adhesive flexible PCB,
but its flexibility, bonding force between copper foil and substrate and flatness of solder
Are also better than that of adhesive flexible PCB. So it is only used in the high demand
Situations, such as the: COF (CHIP ON FLEX, flexible board with bare chip, the high
Flatness of the pad) and so on. Because its price is high, most of the flexible PCBs used
in the market are still adhesive flexible circuit board. Because the flexible circuit board
Is mainly used in the situation where bending is required, if the design or process is not
Reasonable, it is easy to produce micro-cracks, welding and other defects.
Economy of using FPC
If the circuit design is relatively simple, the total volume is small, and the space is suitable,
the traditional internal connection is much cheaper. Flexible circuits are a good design option
If the circuit is complex, processes many signals or has special electrical or mechanical
Requirements. When the size and performance of applications exceed the capacity of rigid
Circuits, flexible assembly is the most economical. A 12mil pad with a 5mil through hole
and a flexible circuit with 3mil lines and spacing can be fabricated on a thin film. Therefore,
It is more reliable to mount the chip directly on the film. There is no flame retardant that
Could be an ion source. these films may be protective and solidified at higher temperatures
to obtain higher glass transition temperatures. Flexible materials are less costly than rigid
Materials because they are free of connectors.
FPC Case: 2 Layer Flexible Circuit (FPC) Built on
Polyimide with Stiffener for Door Access System
(Flexible printed circuits are custom-made products, the picture and parameters shown
Are just for reference)
General description
this is a type of 2 Layer flexible printed circuit (FPC) built on polyimide for the
Application of Door Access System.
Basic specifications
Base material: Polyimide 12.5m + 0.2mm polyimide stiffener
Layer count: 2 layers
Type: Individual FPC
Format: 129mm x 77.3mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 m/ Inner layer 0 m
Solder mask / Legend: Yellow coverlay / No.
Final PCB height: 0.15 mm
Standard: IPC 6012 Class 2
Packing: 100 pieces are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months
Features and benefits
Consistency of assembly;
Reliability increased;
Controllability of electrical parameter design;
Small quantity order is accepted;
12 hours quotation;
16000 square meter workshop;
30000 square meter month capability;
8000 types of PCB's per month;
Application
LCD module, POS antenna soft board, medical equipment controller, automobile
GPS navigation flex board, Touch screen, LCD TV soft board, Digital camera soft
Board
General Properties of 2 Layer FCCL
Explanations:
C = Humidity conditioning;
E = Temperature conditioning;
* Certified to IPC-4204/25 Copper Clad Adhesiveless, Cast and Curied Polyimide
Product Code Description
SF202 05 12 D T
SF202: Shengyi Adhesiveless FCCL Designation
05: PI Film Thickness, 05- 12.5m; 08-20m
12: Copper Foil Thickness, 12-12m, 18-18m
D: Double Sided
T:RTF copper; R- RA Copper; E- ED copper
FPC
Developing
According to the combination of base material and copper foil, flexible circuit board can
Be divided into two types: flexible board with adhesive and flexible board without adhesive.
the price of non-adhesive flexible PCB is much higher than that of adhesive flexible PCB,
but its flexibility, bonding force between copper foil and substrate and flatness of solder
Are also better than that of adhesive flexible PCB. So it is only used in the high demand
Situations, such as the: COF (CHIP ON FLEX, flexible board with bare chip, the high
Flatness of the pad) and so on. Because its price is high, most of the flexible PCBs used
in the market are still adhesive flexible circuit board. Because the flexible circuit board
Is mainly used in the situation where bending is required, if the design or process is not
Reasonable, it is easy to produce micro-cracks, welding and other defects.
Economy of using FPC
If the circuit design is relatively simple, the total volume is small, and the space is suitable,
the traditional internal connection is much cheaper. Flexible circuits are a good design option
If the circuit is complex, processes many signals or has special electrical or mechanical
Requirements. When the size and performance of applications exceed the capacity of rigid
Circuits, flexible assembly is the most economical. A 12mil pad with a 5mil through hole
and a flexible circuit with 3mil lines and spacing can be fabricated on a thin film. Therefore,
It is more reliable to mount the chip directly on the film. There is no flame retardant that
Could be an ion source. these films may be protective and solidified at higher temperatures
to obtain higher glass transition temperatures. Flexible materials are less costly than rigid
Materials because they are free of connectors.
FPC Case: 2 Layer Flexible Circuit (FPC) Built on
Polyimide with Stiffener for Door Access System
(Flexible printed circuits are custom-made products, the picture and parameters shown
Are just for reference)
General description
this is a type of 2 Layer flexible printed circuit (FPC) built on polyimide for the
Application of Door Access System.
Basic specifications
Base material: Polyimide 12.5m + 0.2mm polyimide stiffener
Layer count: 2 layers
Type: Individual FPC
Format: 129mm x 77.3mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35 m/ Inner layer 0 m
Solder mask / Legend: Yellow coverlay / No.
Final PCB height: 0.15 mm
Standard: IPC 6012 Class 2
Packing: 100 pieces are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months
Features and benefits
Consistency of assembly;
Reliability increased;
Controllability of electrical parameter design;
Small quantity order is accepted;
12 hours quotation;
16000 square meter workshop;
30000 square meter month capability;
8000 types of PCB's per month;
Application
LCD module, POS antenna soft board, medical equipment controller, automobile
GPS navigation flex board, Touch screen, LCD TV soft board, Digital camera soft
Board
General Properties of 2 Layer FCCL
| Test Item | Treatment Condition |
Unit | Property Date | |||
| IPC Standard * value |
Typical Value | |||||
| SF202 0512DT |
SF202 1012DT | |||||
| Peel Strength (90) | A | N/mm | 0.525 | 1.2 | 1.4 | |
| 288, 5s | 0.525 | 1.2 | 1.4 | |||
| Folding Endurance (MIT) | R0.8 X 4.9N | Times | - | 80 | 50 | |
| Thermal Stress | 288, 20s | - | - | No Delamination |
No Delamination | |
| Dimensional Stability | MD | E-0.5/150 | % | 0.2 | 0.05 | 0.05 |
| TD | 0.05 | 0.05 | ||||
| Chemical Resistance | after Chemical Exposure |
% | 80 | 85 | 85 | |
| Dielectric Constant (1MHz) | C-24/23/50 | - | 4.0 | 3.2 | 3.3 | |
| Dissipation Factor (1MHz) | C-24/23/50 | - | 0.01 | 0.007 | 0.008 | |
| Volume Resistvitiy | C-96/35/90 | M-cm | 10^6 | 4.5 x 10^8 | 3.5 x 10^8 | |
| Surface Resistance | C-96/35/90 | M | 10^5 | 1.5 x 10^6 | 2.0 x 10^6 | |
Explanations:
C = Humidity conditioning;
E = Temperature conditioning;
* Certified to IPC-4204/25 Copper Clad Adhesiveless, Cast and Curied Polyimide
Product Code Description
SF202 05 12 D T
SF202: Shengyi Adhesiveless FCCL Designation
05: PI Film Thickness, 05- 12.5m; 08-20m
12: Copper Foil Thickness, 12-12m, 18-18m
D: Double Sided
T:RTF copper; R- RA Copper; E- ED copper
FPC
Developing