| Surface Finishing: | Immersion Gold |
|---|---|
| Board Thickness: | 1.1mm |
| Copper Thickness: | 35 um |
| Base Material: | Polyimide 12.5um |
| Brand Name: | Bicheng Enterprise Limited |
| Min. Line Spacing: | N/A |
| Min. Line Width: | N/A |
| Min. Hole Size: | N/A |
| Model Number: | BIC-317-V317 |
| Place of Origin: | China (Mainland) |
| Coverlay Colour: | Yellow |
| Color of Silkscreen: | White |
Quick Details
Specifications
Clarifications of FPC
According to the combination of base material and copper foil, flexible circuit board can
Be divided into two types: flexible board with adhesive and flexible board without adhesive.
the price of non-adhesive flexible PCB is much higher than that of adhesive flexible PCB,
but its flexibility, bonding force between copper foil and substrate and flatness of solder
Are also better than that of adhesive flexible PCB. So it is only used in the high demand
Situations, such as the: COF (CHIP ON FLEX, flexible board with bare chip, the high flatness
of the pad) and so on. Because its price is high, most of the flexible PCBs used in the market
Are still adhesive flexible circuit board. Because the flexible circuit board is mainly used in the
Situation where bending is required, if the design or process is not reasonable, it is easy to
Produce micro-cracks, welding and other defects.
Economy of using FPC
If the circuit design is relatively simple, the total volume is small, and the space is suitable,
the traditional internal connection is much cheaper. Flexible circuits are a good design option
If the circuit is complex, processes many signals or has special electrical or mechanical
Requirements. When the size and performance of applications exceed the capacity of rigid
Circuits, flexible assembly is the most economical. A 12mil pad with a 5mil through hole and
A flexible circuit with 3mil lines and spacing can be fabricated on a thin film. Therefore, it is
More reliable to mount the chip directly on the film. There is no flame retardant that could
Be an ion source. these films may be protective and solidified at higher temperatures to
Obtain higher glass transition temperatures. Flexible materials are less costly than rigid
Materials because they are free of connectors.
FPC Case: Flexible Printed Circuit (FPC) Built on
1oz polyimide with FR-4 Support Security Access
Systems
(Flexible printed circuits are custom-made products, the picture and parameters shown
Are just for reference)
General description
this is a type of 2 Layer flexible printed circuit (FPC) built on 1oz polyimide for the
Application of Security Access Systems.
Basic specifications
Base material: Polyimide 12.5m + 1.0mm stiffener of FR-4
Layer count: 2 layers
Type: Individual FPC
Format: 84.0mm x 12.0mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35m/ Inner layer 0 m
Solder mask / Legend: yellow coverlay / White
Final PCB height: 1.1 mm (inclusive of stiffener)
Standard: IPC 6012 Class 2
Packing: 100 pieces are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months
Features and benefits
PCB volume is reduced;
Weight reduction;
Consistency of assembly;
High solderability, no stressing of circuit boards and less contamination of PCB surface;
Competitive price;
on-time service;
Prototype PCB capability;
Volume Production capability;
Application
General purpose LED soft light strip,FFC for industrial control equipment,Flexible flat cable,
Camera flex board
General Properties of Single Sided FCCL
Explanations:
C = Humidity conditioning;
E = Temperature conditioning;
* Certified to IPC-4204/11 Copper Clad Adhesiveless Polyimide
Product Code Description
SF201 05 12 S E
SF201: Shengyi Adhesiveless FCCL Designation
05: PI Film Thickness, 05- 12.5m; 08-20m
12: Copper Foil Thickness, 12-12m, 18-18m
S: Single Sided
E- ED copper; R- RA Copper
FPC
Heavy copper tester
According to the combination of base material and copper foil, flexible circuit board can
Be divided into two types: flexible board with adhesive and flexible board without adhesive.
the price of non-adhesive flexible PCB is much higher than that of adhesive flexible PCB,
but its flexibility, bonding force between copper foil and substrate and flatness of solder
Are also better than that of adhesive flexible PCB. So it is only used in the high demand
Situations, such as the: COF (CHIP ON FLEX, flexible board with bare chip, the high flatness
of the pad) and so on. Because its price is high, most of the flexible PCBs used in the market
Are still adhesive flexible circuit board. Because the flexible circuit board is mainly used in the
Situation where bending is required, if the design or process is not reasonable, it is easy to
Produce micro-cracks, welding and other defects.
Economy of using FPC
If the circuit design is relatively simple, the total volume is small, and the space is suitable,
the traditional internal connection is much cheaper. Flexible circuits are a good design option
If the circuit is complex, processes many signals or has special electrical or mechanical
Requirements. When the size and performance of applications exceed the capacity of rigid
Circuits, flexible assembly is the most economical. A 12mil pad with a 5mil through hole and
A flexible circuit with 3mil lines and spacing can be fabricated on a thin film. Therefore, it is
More reliable to mount the chip directly on the film. There is no flame retardant that could
Be an ion source. these films may be protective and solidified at higher temperatures to
Obtain higher glass transition temperatures. Flexible materials are less costly than rigid
Materials because they are free of connectors.
FPC Case: Flexible Printed Circuit (FPC) Built on
1oz polyimide with FR-4 Support Security Access
Systems
(Flexible printed circuits are custom-made products, the picture and parameters shown
Are just for reference)
General description
this is a type of 2 Layer flexible printed circuit (FPC) built on 1oz polyimide for the
Application of Security Access Systems.
Basic specifications
Base material: Polyimide 12.5m + 1.0mm stiffener of FR-4
Layer count: 2 layers
Type: Individual FPC
Format: 84.0mm x 12.0mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35m/ Inner layer 0 m
Solder mask / Legend: yellow coverlay / White
Final PCB height: 1.1 mm (inclusive of stiffener)
Standard: IPC 6012 Class 2
Packing: 100 pieces are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months
Features and benefits
PCB volume is reduced;
Weight reduction;
Consistency of assembly;
High solderability, no stressing of circuit boards and less contamination of PCB surface;
Competitive price;
on-time service;
Prototype PCB capability;
Volume Production capability;
Application
General purpose LED soft light strip,FFC for industrial control equipment,Flexible flat cable,
Camera flex board
General Properties of Single Sided FCCL
| Test Item | Treatment Condition |
Unit | Property Date | |||
| IPC Standard * value |
Typical Value | |||||
| SF201 0512SE |
SF201 0518SR | |||||
| Peel Strength (90) | A | N/mm | 0.525 | 1.0 | 0.9 | |
| 288, 5s | 0.525 | 1.0 | 0.9 | |||
| Folding Endurance (MIT) | R0.8 X 4.9N | Times | - | 10000 | 10000 | |
| Thermal Stress | 288, 20s | - | - | No Delamination |
No Delamination | |
| Dimensional Stability | MD | E-0.5/150 | % | 0.2 | 0.1 | 0.1 |
| TD | 0.1 | 0.1 | ||||
| Chemical Resistance | after Chemical Exposure |
% | 80 | 90 | 90 | |
| Dielectric Constant (1MHz) | C-24/23/50 | - | 4.0 | 3.2 | 3.2 | |
| Dissipation Factor (1MHz) | C-24/23/50 | - | 0.01 | 0.008 | 0.008 | |
| Volume Resistvitiy | C-96/35/90 | M-cm | 10^6 | 4.5 x 10^8 | 4.5 x 10^8 | |
| Surface Resistance | C-96/35/90 | M | 10^5 | 3.0 x 10^6 | 3.0 x 10^6 | |
Explanations:
C = Humidity conditioning;
E = Temperature conditioning;
* Certified to IPC-4204/11 Copper Clad Adhesiveless Polyimide
Product Code Description
SF201 05 12 S E
SF201: Shengyi Adhesiveless FCCL Designation
05: PI Film Thickness, 05- 12.5m; 08-20m
12: Copper Foil Thickness, 12-12m, 18-18m
S: Single Sided
E- ED copper; R- RA Copper
FPC
Heavy copper tester