Structure of MCPCB
the most common MCPCB construction consists of the following layers:
1) A metal substrate, typically aluminum. In some applications, a copper substrate is more
Appropriate due to its high thermal conductivity than aluminum (401W/MK versus 237 W/MK)
but more expensive.

2) Epoxy dielectric layer. this is the most important layer in the MCPCB construction as it
Affects the thermal performance, electrical breakdown strength, and, in some cases, the
Solder joint performance of the MCPCB system. the typical thermal conductivity of the
Dielectric layer on a MCPCB is 1W/MK. A higher value is better for good thermal performance.
A thinner dielectric layer is better for thermal performance as well but can negatively impact
the ability of the MCPCB to withstand a high potential test to meet minimum electrical safety
Standards as required in certain lighting markets. the typical dielectric thickness layer is 100m.

3) Top copper layer. A thicker copper layer improves heat spreading into the PCB but may pose
Challenges for PCB manufacturers when fabricating narrow traces or spaces. A copper thickness
of 1oz (35m) or 2oz (70m) is common.



MCPCB Case: Aluminum PCB Built on 5052 Plate with
Composite Structure
(PCB's are custom-made products, the picture and parameters shown are just for reference)

General description
this is a type of Aluminum PCB for the application of motor driver. It's a single layer MCPCB
Board at 1.6 mm thick with 1 W/MK thermal conductivity. It's built with composite structure.
the aluminum plate is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated per
IPC 6012 Class 2 using supplied Gerber data. 20 boards are packed shipment. 


Features and benefits
SMT process
Effective heat dissipation reduces the operating temperature of the module and prolongs
the service life. 
Power density and reliability are improved up 10%.
Reduce the dependence of heat sinks and other hardware (including thermal interface
Materials),
Reduce the volume of the product,
Reduce the cost of hardware and assembly,
High voltage test, Impedance control test, micro-section, solder-ability test, thermal stress
Test, reliability test, insulation resistance test and ionic contamination test,
Eligible products rate of first production: >95%  
Small quantity order is accepted
Delivery on time: >98%  
Customer complaint rate: <1% 


Application
Preamplifier, Office automation equipment, CPU board, Floppy disk driver, Downlight 


Parameter and data sheet