| Surface Finishing: | Electroless nickel over Immersion Gold (ENIG) |
|---|---|
| Board Thickness: | 1.6mm |
| Copper Thickness: | 1 oz |
| Base Material: | 1W/MK dielectric material, MCPCB |
| Brand Name: | Bicheng Enterprise Limited |
| Min. Line Spacing: | 14 mil |
| Min. Line Width: | 15 mil |
| Min. Hole Diameter: | 2.5mm |
| Model Number: | BIC-757-V757 |
| Place of Origin: | China (Mainland) |
| Solder Mask Color: | White |
| Colour of Component Legend: | no silkscreen required |
| TEST: | 100% Electrical Test prior shipment |
Quick Details
Specifications
Structure of MCPCB
the most common MCPCB construction consists of the following layers:
1) A metal substrate, typically aluminum. In some applications, a copper substrate is more
Appropriate due to its high thermal conductivity than aluminum (401W/MK versus 237 W/MK)
but more expensive.
2) Epoxy dielectric layer. this is the most important layer in the MCPCB construction as it
Affects the thermal performance, electrical breakdown strength, and, in some cases, the
Solder joint performance of the MCPCB system. the typical thermal conductivity of the
Dielectric layer on a MCPCB is 1W/MK. A higher value is better for good thermal performance.
A thinner dielectric layer is better for thermal performance as well but can negatively impact
the ability of the MCPCB to withstand a high potential test to meet minimum electrical safety
Standards as required in certain lighting markets. the typical dielectric thickness layer is 100m.
3) Top copper layer. A thicker copper layer improves heat spreading into the PCB but may
Pose challenges for PCB manufacturers when fabricating narrow traces or spaces. A copper
Thickness of 1oz (35m) or 2oz (70m) is common.

MCPCB Case: Aluminum PCB Made on 1oz Copper with
Countersunk Holes
(PCB's are custom-made products, the picture and parameters shown are just for reference)
General description
this is a type of Aluminum PCB for the application of audio amplifier. It's a single layer
MCPCB board at 1.6 mm thick with 1 W/MK thermal conductivity. The aluminum plate
Is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012 Class
2 using supplied Gerber data. 25 boards are packed separately.
Features and benefits
SMT process
Effective heat dissipation reduces the operating temperature of the module and prolongs
the service life.
Power density and reliability are improved up 10%.
Reduce the dependence of heat sinks and other hardware (including thermal interface
Materials),
Reduce the volume of the product,
Reduce the cost of hardware and assembly,
Whole fabrication processes are totally controlled.
Meeting your printed circuit board needs from PCB prototyping to mass volume production.
UL, ISO certified PCB manufacturing factory.
Great customer service
Diversified shipping method
UL recognized and RoHS Directive-compliant
Application
Power supply equipment,Motor controller, Power module, Ceiling lamp aluminum PCB
Parameter and data sheet
Variety of PCBs

Automatic test machine

the most common MCPCB construction consists of the following layers:
1) A metal substrate, typically aluminum. In some applications, a copper substrate is more
Appropriate due to its high thermal conductivity than aluminum (401W/MK versus 237 W/MK)
but more expensive.
2) Epoxy dielectric layer. this is the most important layer in the MCPCB construction as it
Affects the thermal performance, electrical breakdown strength, and, in some cases, the
Solder joint performance of the MCPCB system. the typical thermal conductivity of the
Dielectric layer on a MCPCB is 1W/MK. A higher value is better for good thermal performance.
A thinner dielectric layer is better for thermal performance as well but can negatively impact
the ability of the MCPCB to withstand a high potential test to meet minimum electrical safety
Standards as required in certain lighting markets. the typical dielectric thickness layer is 100m.
3) Top copper layer. A thicker copper layer improves heat spreading into the PCB but may
Pose challenges for PCB manufacturers when fabricating narrow traces or spaces. A copper
Thickness of 1oz (35m) or 2oz (70m) is common.
MCPCB Case: Aluminum PCB Made on 1oz Copper with
Countersunk Holes
(PCB's are custom-made products, the picture and parameters shown are just for reference)
General description
this is a type of Aluminum PCB for the application of audio amplifier. It's a single layer
MCPCB board at 1.6 mm thick with 1 W/MK thermal conductivity. The aluminum plate
Is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012 Class
2 using supplied Gerber data. 25 boards are packed separately.
Features and benefits
SMT process
Effective heat dissipation reduces the operating temperature of the module and prolongs
the service life.
Power density and reliability are improved up 10%.
Reduce the dependence of heat sinks and other hardware (including thermal interface
Materials),
Reduce the volume of the product,
Reduce the cost of hardware and assembly,
Whole fabrication processes are totally controlled.
Meeting your printed circuit board needs from PCB prototyping to mass volume production.
UL, ISO certified PCB manufacturing factory.
Great customer service
Diversified shipping method
UL recognized and RoHS Directive-compliant
Application
Power supply equipment,Motor controller, Power module, Ceiling lamp aluminum PCB
Parameter and data sheet
| PCB SIZE | 65 x 65mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Single sided PCB |
| Surface Mount Components | YES |
| through Hole Components | NO |
| LAYER STACKUP | Copper ------- 35um(1oz) |
| 1W/MK dielectric material | |
| Aluminum 5052 | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 14mil/15mil |
| Minimum / Maximum Holes: | 2.5/8.5mm |
| Number of Different Holes: | 4 |
| Number of Drill Holes: | 18 |
| Thermal resistance(C/W) | 0.45 |
| Breakdown Voltage(VDC) | 4000 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Thermal conductivity | 1W/MK dielectric material, MCPCB |
| Final foil external: | 1oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 1.6mm 0.16 |
| PLATING and COATING | |
| Surface Finish | Electroless nickel over Immersion Gold (ENIG) ( 1 " over 100 " nickel) |
| Solder Mask Apply to: | Top. 12m Minimum. |
| Solder Mask Color: | White,PSR400 WT02 |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | No silkscreen required |
| Colour of Component Legend | No silkscreen required |
| Manufacturer Name or Logo: | No silkscreen required |
| VIA | No via |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE of ARTWORK to BE SUPPLIED | Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Variety of PCBs
Automatic test machine

