Structure of MCPCB
the most common MCPCB construction consists of the following layers:
1) A metal substrate, typically aluminum. In some applications, a copper substrate is more
Appropriate due to its high thermal conductivity than aluminum (401W/MK versus 237 W/MK)
but more expensive.

2) Epoxy dielectric layer. this is the most important layer in the MCPCB construction as it
Affects the thermal performance, electrical breakdown strength, and, in some cases, the
Solder joint performance of the MCPCB system. the typical thermal conductivity of the
Dielectric layer on a MCPCB is 1W/MK. A higher value is better for good thermal performance.
A thinner dielectric layer is better for thermal performance as well but can negatively impact
the ability of the MCPCB to withstand a high potential test to meet minimum electrical safety
Standards as required in certain lighting markets. the typical dielectric thickness layer is 100m.

3) Top copper layer. A thicker copper layer improves heat spreading into the PCB but may
Pose challenges for PCB manufacturers when fabricating narrow traces or spaces. A copper
Thickness of 1oz (35m) or 2oz (70m) is common.



MCPCB Case: Aluminum PCB with 1W / MK for LED
Lighting
(PCB's are custom-made products, the picture and parameters shown are just for reference)

General description
this is a type of Aluminum PCB for the application of LED Lighting. It's a single layer MCPCB
Board at 1.6 mm thick with 1 W/MK thermal conductivity. The aluminum plate is from ITEQ,
Solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using supplied
Gerber data. 25 boards are packed for shipment.


Features and benefits
SMT process
Effective heat dissipation reduces the operating temperature of the module and prolongs
the service life. 
Power density and reliability are improved up 10%.
Reduce the dependence of heat sinks and other hardware (including thermal interface
Materials),
Reduce the volume of the product,
Reduce the cost of hardware and assembly,
Make delivery on time keeping 98% on-time-delivery rate.
DDU Door to door shipment with competitive shipping cost
Engineering design prevents problems from occurring in pre-production
RoHS materials
UL conformed
Professional and experienced engineers


Application
High frequency amplifier, Automobile, Insulation heat conduction of semiconductor
Devices, Module aluminum PCB


Parameter and data sheet