| Surface Finishing: | Hot Air Soldering Leveling(HASL),lead free |
|---|---|
| Board Thickness: | 1.6mm |
| Copper Thickness: | 1 oz |
| Base Material: | 1W / MK dielectric material 75um |
| Brand Name: | Bicheng Enterprise Limited |
| Min. Line Spacing: | 12 mil |
| Min. Line Width: | 20 mil |
| Min. Hole Diameter: | 12mm |
| Model Number: | BIC-774-V774 |
| Place of Origin: | China (Mainland) |
| Solder Mask Color: | Black |
| Color of Silkscreen: | White |
| TEST: | 100% Electrical Test prior shipment |
Quick Details
Specifications
Structure of MCPCB
the most common MCPCB construction consists of the following layers:
1) A metal substrate, typically aluminum. In some applications, a copper substrate is more
Appropriate due to its high thermal conductivity than aluminum (401W/MK versus 237 W/MK)
but more expensive.
2) Epoxy dielectric layer. this is the most important layer in the MCPCB construction as it
Affects the thermal performance, electrical breakdown strength, and, in some cases, the
Solder joint performance of the MCPCB system. the typical thermal conductivity of the
Dielectric layer on a MCPCB is 1W/MK. A higher value is better for good thermal performance.
A thinner dielectric layer is better for thermal performance as well but can negatively impact
the ability of the MCPCB to withstand a high potential test to meet minimum electrical safety
Standards as required in certain lighting markets. the typical dielectric thickness layer is 100m.
3) Top copper layer. A thicker copper layer improves heat spreading into the PCB but may
Pose challenges for PCB manufacturers when fabricating narrow traces or spaces. A copper
Thickness of 1oz (35m) or 2oz (70m) is common.
Aluminum PCB Case: Aluminum PCB IMS Circuit
Board RoHS for Power Module
(PCB's are custom-made products, the picture and parameters shown are just for reference)
General description
this is a type of aluminum PCB for the application of power module. It's a single layer
MCPCB board at 1.6 mm thick with 1 W/MK thermal conductivity. The aluminum plate
Is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012 Class
2 using supplied Gerber data. 30 boards are packed separately.
Features and benefits
Optimization combination of power circuit and control circuit,
Replace the fragile ceramic substrate and obtain a better mechanical durability,
Effective heat diffusion in the design of the circuit,
Reduce the operating temperature of the equipment,
Improve the power density and reliability of the device,
Prolong the service life of the product,
Strict WIP inspection and monitoring as well as working instruction,
High voltage test, Impedance control test, micro-section, solder-ability test,
Eligible products rate of first production: >95%
UL recognized and RoHS Directive-compliant
High technology
Customer complaint rate: <1%
Application
Fluorescent lamp, CPU board, Floppy disk driver, Communication electronic equipment,
Power supply equipment
Parameter and data sheet
Variety of PCBs
Inner layer brown oxidation
the most common MCPCB construction consists of the following layers:
1) A metal substrate, typically aluminum. In some applications, a copper substrate is more
Appropriate due to its high thermal conductivity than aluminum (401W/MK versus 237 W/MK)
but more expensive.
2) Epoxy dielectric layer. this is the most important layer in the MCPCB construction as it
Affects the thermal performance, electrical breakdown strength, and, in some cases, the
Solder joint performance of the MCPCB system. the typical thermal conductivity of the
Dielectric layer on a MCPCB is 1W/MK. A higher value is better for good thermal performance.
A thinner dielectric layer is better for thermal performance as well but can negatively impact
the ability of the MCPCB to withstand a high potential test to meet minimum electrical safety
Standards as required in certain lighting markets. the typical dielectric thickness layer is 100m.
3) Top copper layer. A thicker copper layer improves heat spreading into the PCB but may
Pose challenges for PCB manufacturers when fabricating narrow traces or spaces. A copper
Thickness of 1oz (35m) or 2oz (70m) is common.
Aluminum PCB Case: Aluminum PCB IMS Circuit
Board RoHS for Power Module
(PCB's are custom-made products, the picture and parameters shown are just for reference)
General description
this is a type of aluminum PCB for the application of power module. It's a single layer
MCPCB board at 1.6 mm thick with 1 W/MK thermal conductivity. The aluminum plate
Is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012 Class
2 using supplied Gerber data. 30 boards are packed separately.
Features and benefits
Optimization combination of power circuit and control circuit,
Replace the fragile ceramic substrate and obtain a better mechanical durability,
Effective heat diffusion in the design of the circuit,
Reduce the operating temperature of the equipment,
Improve the power density and reliability of the device,
Prolong the service life of the product,
Strict WIP inspection and monitoring as well as working instruction,
High voltage test, Impedance control test, micro-section, solder-ability test,
Eligible products rate of first production: >95%
UL recognized and RoHS Directive-compliant
High technology
Customer complaint rate: <1%
Application
Fluorescent lamp, CPU board, Floppy disk driver, Communication electronic equipment,
Power supply equipment
Parameter and data sheet
| PCB SIZE | 96 x 96mm=1PCS |
| BOARD TYPE | IMS PCB |
| Number of Layers | Single sided PCB |
| Surface Mount Components | YES |
| through Hole Components | NO |
| LAYER STACKUP | Copper ------- 70um(2oz) |
| 1W/MK dielectric material 75um | |
| Aluminum 6061 1.5mm | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 12mil/20mil |
| Minimum / Maximum Holes: | 3mm / 5.0mm |
| Number of Different Holes: | 12 |
| Number of Drill Holes: | 3 |
| Number of Milled Slots: | 2 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Aluminum core: | 1W / MK dielectric material 75um |
| Thermal resistance(C/W) | 0.45 |
| Breakdown Voltage(VDC) | 4000 |
| Final foil external: | 1oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 1.6mm 0.16 |
| PLATING and COATING | |
| Surface Finish | Hot air soldering leveling(HASL),lead free, Sn>=2.54m |
| Solder Mask Apply to: | TOP, 12micron Minimum |
| Solder Mask Color: | Black, KSM-S6189BK31 |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, IJR-4000 MW300 |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Non Plated Throught Hole (NPTH) |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE of ARTWORK to BE SUPPLIED | Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Variety of PCBs
Inner layer brown oxidation