Surface Finishing: | HASL |
---|---|
Board Thickness: | 1.2mm |
Copper Thickness: | 1.0 OZ |
Base Material: | 1W/MK thermal conductivity |
Brand Name: | Bicheng Enterprise Limited |
Min. Line Spacing: | N/A |
Min. Line Width: | N/A |
Min. Hole Diameter: | N/A |
Model Number: | BIC-804-V804 |
Place of Origin: | China (Mainland) |
Solder mask Colour: | White |
Silkscreen Color: | Black |
TEST: | 100% Electrical Test prior shipment |
Quick Details
Specifications
COB Mirror Aluminum PCB | Metal Core Circuit Board
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Mirror Aluminum PCB
the mirror aluminum PCB is a substrate which is pressed together with BT material circuit
Layer and aluminum substrate with silver particles. It is the most suitable raw material for
COB packaging.
Advantages
Good heat dissipation: the mirror silver aluminum substrate adopts thermoelectric separation
Technology, and the thermal conductivity of ordinary aluminum PCB with insulating layer is
1W/MK to 3W/MK. the thermal conductivity of mirror aluminum PCB reaches higher 137W/MK,
Which greatly improves the heat dissipation of the chip.
High light efficiency: the reflectivity of the ordinary gold aluminum PCB is 80%, the reflectivity
of the cup hole aluminum PCB is 85%, the reflectivity of the silver plated aluminum PCB is 95%,
and the reflectivity of the mirror silver aluminum PCB is 98%. the mirror silver aluminum PCB
Can make the light of the chip better excited.
PCB Services
1) Prototype, small runs and mass production supply
2) V-Groove, Punch, CNC mill
3) ENIG, HASL, OSP and Immersion tin
4) No MOQ
5) Door to door shipping service
Metal Core PCB Capability 2019
MCPCB
MCPCB
Developing line
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Mirror Aluminum PCB
the mirror aluminum PCB is a substrate which is pressed together with BT material circuit
Layer and aluminum substrate with silver particles. It is the most suitable raw material for
COB packaging.
Advantages
Good heat dissipation: the mirror silver aluminum substrate adopts thermoelectric separation
Technology, and the thermal conductivity of ordinary aluminum PCB with insulating layer is
1W/MK to 3W/MK. the thermal conductivity of mirror aluminum PCB reaches higher 137W/MK,
Which greatly improves the heat dissipation of the chip.
High light efficiency: the reflectivity of the ordinary gold aluminum PCB is 80%, the reflectivity
of the cup hole aluminum PCB is 85%, the reflectivity of the silver plated aluminum PCB is 95%,
and the reflectivity of the mirror silver aluminum PCB is 98%. the mirror silver aluminum PCB
Can make the light of the chip better excited.
PCB Services
1) Prototype, small runs and mass production supply
2) V-Groove, Punch, CNC mill
3) ENIG, HASL, OSP and Immersion tin
4) No MOQ
5) Door to door shipping service
Metal Core PCB Capability 2019
NO. | Parameter | Value |
1 | Type of Metal Core | Aluminum, Copper, Iron |
2 | Model of Metal Core | A1100, A5052, A6061, A6063, C1100 |
3 | Surface Finish | HASL, Immersion Gold, Immersion Silver, OSP |
4 | Thickness of Surface plating | HASL: Sn>2.54M, ENIG: Au 0.025-0.1m, Ni 2.5-5m |
5 | Layer Count | 1-4 Layers |
6 | Maximum of Board Size | 23" x 46" (584mm1168mm) |
7 | Mininum of Board Size | 0.1969" x 0.1969" (5mm5mm) |
8 | Board Thickness | 0.0157" x 0.2362" (0.4-6.0mm) |
9 | Copper Thickness | 0.5OZ(17.5m),1OZ(35m),2OZ(70m) 3OZ(105m),4OZ(140m) to 10oz (350m) |
10 | Minimum Track Width | 5mil (0.127mm) |
11 | Minimum Space | 5mil (0.127mm) |
12 | Minimum Hole Size | 0.0197" (0.5mm) |
13 | Maximum Hole Size | No limit |
14 | Minimum Holes Punched | PCB thickness <1.0mm: 0.0394" (1.0mm) |
PCB thikness 1.2-3.0mm: 0.0591" (1.5mm) | ||
15 | PTH Wall Thickness | >20m |
16 | Tolerance of PTH | 0.00295" (0.075mm) |
17 | Tolerance of NPTH | 0.00197" (0.05mm) |
18 | Deviation of Hole Position | 0.00394" (0.10mm) |
19 | Outline Tolerance | Routing: 0.00394" (0.1mm) |
Punching: 0.00591" (0.15mm) | ||
20 | Angle of V-cut | 30, 45, 60 |
21 | V-cut Size | 0.1969" x 47.24" (5mm1200mm) |
22 | Thickness of V-cut Board | 0.0236" x 0.1181" (0.6-3mm) |
23 | Tolerance of V-cut Angle | 5 |
24 | V-CUT Verticality | 0.0059" (0.15mm) |
25 | Minimum Square Slots Punched | PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm) |
PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm) | ||
26 | Minimum BGA PAD | 0.01378" (0.35mm) |
27 | Minimum Width of Solder Mask Bridge. | 8mil (0.2032mm) |
28 | Minimum Thickness of Solder Mask | >13M (0.013mm) |
29 | Insulation Resistance | 1012Normal |
30 | Peel-off Strength | 2.2N/mm |
31 | Solder float | 260 3min |
32 | E-test Voltage | 50-250V |
33 | Thermal Conductivity | 0.8-8W/M.K |
34 | Warp or Twist | 0.5% |
35 | Flammability | FV-0 |
36 | Minimum Height of Component indicator | 0.0059"(0.15mm) |
37 | Minimum Open Solder Mask on Pad | 0.000394" (0.01mm) |
MCPCB
MCPCB
Developing line