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Quick Details

Surface Finishing: Immersion gold
Board Thickness: 1.0mm
Copper Thickness: 1.0 OZ
Base Material: 1W/MK dielectric material 75um
Brand Name: Bicheng Enterprise Limited
Min. Line Spacing: N/A
Min. Line Width: N/A
Min. Hole Diameter: N/A
Model Number: BIC-811-V811
Place of Origin: China (Mainland)
Solder mask Colour: White
Silkscreen Color: Black
TEST: 100% Electrical Test prior shipment

Specifications

98% Reflectivity Mirror Aluminum PCB | Metal Core
Circuit Board

(PCB's are custom-made products, the picture and parameters shown are just for reference)

Mirror Aluminum PCB
the mirror aluminum PCB is a substrate which is pressed together with BT material circuit
Layer and aluminum substrate with silver particles. It is the most suitable raw material for
COB packaging.


Advantages
Good heat dissipation: the mirror silver aluminum substrate adopts thermoelectric separation
Technology, and the thermal conductivity of ordinary aluminum PCB with insulating layer is
1W/MK to 3W/MK. the thermal conductivity of mirror aluminum PCB reaches higher 137W/MK,
Which greatly improves the heat dissipation of the chip.


High light efficiency: the reflectivity of the ordinary gold aluminum PCB is 80%, the reflectivity
of the cup hole aluminum PCB is 85%, the reflectivity of the silver plated aluminum PCB is 95%,
and the reflectivity of the mirror silver aluminum PCB is 98%. the mirror silver aluminum PCB
Can make the light of the chip better excited.


PCB Services
1) Prototype, small runs and mass production supply
2) V-Groove, Punch, CNC mill
3) ENIG, HASL, OSP and Immersion tin
4) No MOQ
5) Door to door shipping service

98 Reflectivity Mirror Aluminum PCB Metal Core Circuit Board


Metal Core PCB Capability 2019
NO. Parameter Value
1 Type of Metal Core Aluminum, Copper, Iron
2 Model of Metal Core A1100, A5052, A6061, A6063, C1100
3 Surface Finish HASL, Immersion Gold, Immersion Silver, OSP
4 Thickness of Surface plating HASL: Sn>2.54M, ENIG: Au 0.025-0.1m,
Ni 2.5-5m
5 Layer Count 1-4 Layers
6 Maximum of Board Size 23" x 46" (584mm1168mm)
7 Mininum of Board Size 0.1969" x 0.1969" (5mm5mm)
8 Board Thickness 0.0157" x 0.2362" (0.4-6.0mm)
9 Copper Thickness 0.5OZ(17.5m),1OZ(35m),2OZ(70m)
3OZ(105m),4OZ(140m) to 10oz (350m)
10 Minimum Track Width 5mil (0.127mm)
11 Minimum Space 5mil (0.127mm)
12 Minimum Hole Size 0.0197" (0.5mm)
13 Maximum Hole Size No limit
14 Minimum Holes Punched PCB thickness <1.0mm: 0.0394" (1.0mm)
PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)
15 PTH Wall Thickness >20m
16 Tolerance of PTH 0.00295" (0.075mm) 
17 Tolerance of NPTH 0.00197" (0.05mm) 
18 Deviation of Hole Position  0.00394" (0.10mm) 
19 Outline Tolerance Routing: 0.00394" (0.1mm)
Punching: 0.00591" (0.15mm) 
20 Angle of V-cut 30, 45, 60
21 V-cut Size 0.1969" x 47.24" (5mm1200mm)
22 Thickness of V-cut Board 0.0236" x 0.1181" (0.6-3mm)
23 Tolerance of V-cut Angle 5
24 V-CUT Verticality 0.0059" (0.15mm)
25 Minimum Square Slots Punched PCB thickness < 1.0mm: 0.0315" x 0.0315"
(0.8 x 0.8mm)
PCB thickness 1.2-3.0mm: 0.0394" x 0.0394"
(1.0 x 1.0mm)
26 Minimum BGA PAD 0.01378" (0.35mm)
27 Minimum Width of Solder Mask Bridge. 8mil (0.2032mm)
28 Minimum Thickness of Solder Mask >13M (0.013mm)
29 Insulation Resistance 1012Normal
30 Peel-off Strength 2.2N/mm
31 Solder float 260 3min
32 E-test Voltage 50-250V
33 Thermal Conductivity 0.8-8W/M.K
34 Warp or Twist 0.5%
35 Flammability FV-0
36 Minimum Height of Component indicator 0.0059"(0.15mm)
37 Minimum Open Solder Mask on Pad 0.000394" (0.01mm)


MCPCB
98 Reflectivity Mirror Aluminum PCB Metal Core Circuit Board
MCPCB
98 Reflectivity Mirror Aluminum PCB Metal Core Circuit Board
Heavy copper tester
98 Reflectivity Mirror Aluminum PCB Metal Core Circuit Board

98 Reflectivity Mirror Aluminum PCB Metal Core Circuit Board