Surface Finishing: | Immersion gold |
---|---|
Board Thickness: | 1.0mm |
Copper Thickness: | 1.0 OZ |
Base Material: | 1W/MK dielectric material 75um |
Brand Name: | Bicheng Enterprise Limited |
Min. Line Spacing: | N/A |
Min. Line Width: | N/A |
Min. Hole Diameter: | N/A |
Model Number: | BIC-811-V811 |
Place of Origin: | China (Mainland) |
Solder mask Colour: | White |
Silkscreen Color: | Black |
TEST: | 100% Electrical Test prior shipment |
Quick Details
Specifications
98% Reflectivity Mirror Aluminum PCB | Metal Core
Circuit Board
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Mirror Aluminum PCB
the mirror aluminum PCB is a substrate which is pressed together with BT material circuit
Layer and aluminum substrate with silver particles. It is the most suitable raw material for
COB packaging.
Advantages
Good heat dissipation: the mirror silver aluminum substrate adopts thermoelectric separation
Technology, and the thermal conductivity of ordinary aluminum PCB with insulating layer is
1W/MK to 3W/MK. the thermal conductivity of mirror aluminum PCB reaches higher 137W/MK,
Which greatly improves the heat dissipation of the chip.
High light efficiency: the reflectivity of the ordinary gold aluminum PCB is 80%, the reflectivity
of the cup hole aluminum PCB is 85%, the reflectivity of the silver plated aluminum PCB is 95%,
and the reflectivity of the mirror silver aluminum PCB is 98%. the mirror silver aluminum PCB
Can make the light of the chip better excited.
PCB Services
1) Prototype, small runs and mass production supply
2) V-Groove, Punch, CNC mill
3) ENIG, HASL, OSP and Immersion tin
4) No MOQ
5) Door to door shipping service
Metal Core PCB Capability 2019
MCPCB
MCPCB
Heavy copper tester
Circuit Board
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Mirror Aluminum PCB
the mirror aluminum PCB is a substrate which is pressed together with BT material circuit
Layer and aluminum substrate with silver particles. It is the most suitable raw material for
COB packaging.
Advantages
Good heat dissipation: the mirror silver aluminum substrate adopts thermoelectric separation
Technology, and the thermal conductivity of ordinary aluminum PCB with insulating layer is
1W/MK to 3W/MK. the thermal conductivity of mirror aluminum PCB reaches higher 137W/MK,
Which greatly improves the heat dissipation of the chip.
High light efficiency: the reflectivity of the ordinary gold aluminum PCB is 80%, the reflectivity
of the cup hole aluminum PCB is 85%, the reflectivity of the silver plated aluminum PCB is 95%,
and the reflectivity of the mirror silver aluminum PCB is 98%. the mirror silver aluminum PCB
Can make the light of the chip better excited.
PCB Services
1) Prototype, small runs and mass production supply
2) V-Groove, Punch, CNC mill
3) ENIG, HASL, OSP and Immersion tin
4) No MOQ
5) Door to door shipping service
Metal Core PCB Capability 2019
NO. | Parameter | Value |
1 | Type of Metal Core | Aluminum, Copper, Iron |
2 | Model of Metal Core | A1100, A5052, A6061, A6063, C1100 |
3 | Surface Finish | HASL, Immersion Gold, Immersion Silver, OSP |
4 | Thickness of Surface plating | HASL: Sn>2.54M, ENIG: Au 0.025-0.1m, Ni 2.5-5m |
5 | Layer Count | 1-4 Layers |
6 | Maximum of Board Size | 23" x 46" (584mm1168mm) |
7 | Mininum of Board Size | 0.1969" x 0.1969" (5mm5mm) |
8 | Board Thickness | 0.0157" x 0.2362" (0.4-6.0mm) |
9 | Copper Thickness | 0.5OZ(17.5m),1OZ(35m),2OZ(70m) 3OZ(105m),4OZ(140m) to 10oz (350m) |
10 | Minimum Track Width | 5mil (0.127mm) |
11 | Minimum Space | 5mil (0.127mm) |
12 | Minimum Hole Size | 0.0197" (0.5mm) |
13 | Maximum Hole Size | No limit |
14 | Minimum Holes Punched | PCB thickness <1.0mm: 0.0394" (1.0mm) |
PCB thikness 1.2-3.0mm: 0.0591" (1.5mm) | ||
15 | PTH Wall Thickness | >20m |
16 | Tolerance of PTH | 0.00295" (0.075mm) |
17 | Tolerance of NPTH | 0.00197" (0.05mm) |
18 | Deviation of Hole Position | 0.00394" (0.10mm) |
19 | Outline Tolerance | Routing: 0.00394" (0.1mm) |
Punching: 0.00591" (0.15mm) | ||
20 | Angle of V-cut | 30, 45, 60 |
21 | V-cut Size | 0.1969" x 47.24" (5mm1200mm) |
22 | Thickness of V-cut Board | 0.0236" x 0.1181" (0.6-3mm) |
23 | Tolerance of V-cut Angle | 5 |
24 | V-CUT Verticality | 0.0059" (0.15mm) |
25 | Minimum Square Slots Punched | PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm) |
PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm) | ||
26 | Minimum BGA PAD | 0.01378" (0.35mm) |
27 | Minimum Width of Solder Mask Bridge. | 8mil (0.2032mm) |
28 | Minimum Thickness of Solder Mask | >13M (0.013mm) |
29 | Insulation Resistance | 1012Normal |
30 | Peel-off Strength | 2.2N/mm |
31 | Solder float | 260 3min |
32 | E-test Voltage | 50-250V |
33 | Thermal Conductivity | 0.8-8W/M.K |
34 | Warp or Twist | 0.5% |
35 | Flammability | FV-0 |
36 | Minimum Height of Component indicator | 0.0059"(0.15mm) |
37 | Minimum Open Solder Mask on Pad | 0.000394" (0.01mm) |
MCPCB
MCPCB
Heavy copper tester