3W/MK Aluminum Core PCB | Metal Core Printed
Circuit Board
(PCB's are custom-made products, the picture and parameters shown are just for reference)

the most common MCPCB construction consists of the following 3 layers:
1) A metal substrate, typically aluminum. In some applications, a copper substrate is more
Appropriate due to its high thermal conductivity than aluminum (401W/MK versus 237 W/MK)
but more expensive

2) Epoxy dielectric layer. this is the most important layer in the MCPCB construction as it
Affects the thermal performance, electrical breakdown strength, and, in some cases, the
Solder joint performance of the MCPCB system. the typical thermal conductivity of the
Dielectric layer on a MCPCB is 1W/MK. A higher value is better for good thermal performance.
A thinner dielectric layer is better for thermal performance as well but can negatively impact
the ability of the MCPCB to withstand a high potential test to meet minimum electrical safety
Standards as required in certain lighting markets. the typical dielectric thickness layer is 100m.

3) Top copper layer. A thicker copper layer improves heat spreading into the PCB but may
Pose challenges for PCB manufacturers when fabricating narrow traces or spaces. A copper
Thickness of 1oz (35m) or 2oz (70m) is common.


Metal Core PCB Capability 2019

NO.	Parameter	Value
1	Type of Metal Core	Aluminum, Copper, Iron
2	Model of Metal Core	A1100, A5052, A6061, A6063, C1100
3	Surface Finish	HASL, Immersion Gold, Immersion Silver, OSP
4	Thickness of Surface plating	HASL: Sn>2.54M, ENIG: Au 0.025-0.1m, Ni 2.5-5m
5	Layer Count	1-4 Layers
6	Maximum of Board Size	23" x 46" (584mm1168mm)
7	Mininum of Board Size	0.1969" x 0.1969" (5mm5mm)
8	Board Thickness	0.0157" x 0.2362" (0.4-6.0mm)
9	Copper Thickness	0.5OZ(17.5m),1OZ(35m),2OZ(70m) 3OZ(105m),4OZ(140m) to 10oz (350m)
10	Minimum Track Width	5mil (0.127mm)
11	Minimum Space	5mil (0.127mm)
12	Minimum Hole Size	0.0197" (0.5mm)
13	Maximum Hole Size	No limit
14	Minimum Holes Punched	PCB thickness <1.0mm: 0.0394" (1.0mm)
		PCB thikness 1.2-3.0mm: 0.0591" (1.5mm)
15	PTH Wall Thickness	>20m
16	Tolerance of PTH	0.00295" (0.075mm)
17	Tolerance of NPTH	0.00197" (0.05mm)
18	Deviation of Hole Position	0.00394" (0.10mm)
19	Outline Tolerance	Routing: 0.00394" (0.1mm)
		Punching: 0.00591" (0.15mm)
20	Angle of V-cut	30, 45, 60
21	V-cut Size	0.1969" x 47.24" (5mm1200mm)
22	Thickness of V-cut Board	0.0236" x 0.1181" (0.6-3mm)
23	Tolerance of V-cut Angle	5
24	V-CUT Verticality	0.0059" (0.15mm)
25	Minimum Square Slots Punched	PCB thickness < 1.0mm: 0.0315" x 0.0315" (0.8 x 0.8mm)
		PCB thickness 1.2-3.0mm: 0.0394" x 0.0394" (1.0 x 1.0mm)
26	Minimum BGA PAD	0.01378" (0.35mm)
27	Minimum Width of Solder Mask Bridge.	8mil (0.2032mm)
28	Minimum Thickness of Solder Mask	>13M (0.013mm)
29	Insulation Resistance	1012Normal
30	Peel-off Strength	2.2N/mm
31	Solder float	260 3min
32	E-test Voltage	50-250V
33	Thermal Conductivity	0.8-8W/M.K
34	Warp or Twist	0.5%
35	Flammability	FV-0
36	Minimum Height of Component indicator	0.0059"(0.15mm)
37	Minimum Open Solder Mask on Pad	0.000394" (0.01mm)

MCPCB

MCPCB