Hybrid PCB
with the development of electronic communication technology, the communication frequency
Is becoming higher and higher, and the high frequency signal transmission, need to use low
Dielectric constant (Dk), low dielectric loss (Df) but expensive special materials. these materials
Have cyanate and high frequency materials such as polytetrafluoroethylene / ceramic based
Materials (PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic).
Usually these materials are expensive. 
Reducing the cost is an important means for customers to improve the competitiveness of
Products. Therefore, the customers adopt the laminated structure of mixed materials in the
Design of PCB structure, that is, the necessary signal layer uses high-frequency materials to
Meet the needs of signal transmission. Other line layers are made of conventional fiberglass
Epoxy FR-4, which we call a hybrid board.

Available high frequency material (Core)
RO4350B     RO4003C
4mil (0.1mm)     8mil (0.203mm)
6.6mil (0.168mm)     12mil (0.3mm)
10mil (0.254mm)20mil (0.508mm)
13.3mil (0.338mm)     32mil (0.813mm)
20mil (0.508mm)60mil (1.524mm)
30mil (0.762mm)
60mil (1.524mm)


PCB Case: 4 Layer Hybrid PCB on RO4350B and FR-4
Combined.
(PCB's are custom-made products, the picture and parameters shown are just for reference)


General description
this is a type of 4-layer high frequency PCB built on RO4350B and FR-4 combined for the
Application of multiplexer at 1.7 mm thick. It's HASL finish with green solder mask and white
Silkscreen. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards
Are packed for shipment. 


Features and benefits
Tg > 280
the dielectric constant (DK) is low and stable, so the signal transmission is good without delay.
the characteristic of low dielectric loss makes the signal loss at a lower level, which makes the
Signal transmission of the whole equipment excellent.
SMT process is resistant to reflow soldering, resistant to rework due to gold pads.
PCB manufacturing is strictly as per required specifications. 
Right manufacturing instruction (MI), 
Diversified shipping method
UL recognized and RoHS Directive-compliant
Professional and experienced engineers


Application
Splitter, Radar sensors, RF Switches, Power amplifier 


Parameter and data sheet

PCB SIZE	90 x 64mm=1PCS
BOARD TYPE	Hybrid PCB
Number of Layers	Multilayer PCB, 4 Layer PCB
Surface Mount Components	YES
through Hole Components	YES
LAYER STACKUP	Copper ------- 35um(1oz)+plate TOP layer
	20 mil ROGERS 4350B
	Copper ------- 18um(0.5oz)
	Pregpreg
	Copper ------- 18um(0.5oz)
	28 mil FR-4
	Copper ------- 35um(1oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	7.99mil/9.37mil
Minimum / Maximum Holes:	0.399mm/3.556mm
Number of Different Holes:	7
Number of Drill Holes:	4511
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control	no
BOARD MATERIAL
Glass Epoxy:	FR-4, ITEQ IT-140 TG>135, RO4350B 20mil
Final foil external:	1.5oz
Final foil internal:	0.5oz
Final height of PCB:	1.69mm 0.16
PLATING and COATING
Surface Finish	Immersion Gold (12.7%) 2" over 100" nickel
Solder Mask Apply to:	Top and Bottom, 12micon Minimum.
Solder Mask Color:	Green, LP-4G G-05, Nanya supplied
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	TOP
Colour of Component Legend	White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated through Hole(PTH), via tented.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
TYPE of ARTWORK to BE SUPPLIED	Email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Variety of PCBs


Automatic sticking film machine