| Surface Finishing: | Immersion Gold |
|---|---|
| Board Thickness: | 1.6mm |
| Copper Thickness: | 1.5 oz |
| Base Material: | FR-4. RO4003C 12mil |
| Brand Name: | Bicheng Enterprise Limited |
| Min. Line Spacing: | 4 mil |
| Min. Line Width: | 4 mil |
| Min. Hole Size: | 0.3mm |
| Model Number: | BIC-007-V7 |
| Place of Origin: | China (Mainland) |
| Solder Mask Color: | Green |
| Colour of Component Legend: | White |
| TEST: | 100% Electrical Test prior shipment |
Quick Details
Specifications
Hybrid PCB
with the development of electronic communication technology, the communication frequency
Is becoming higher and higher, and the high frequency signal transmission, need to use low
Dielectric constant (Dk), low dielectric loss (Df) but expensive special materials. these materials
Have cyanate and high frequency materials such as polytetrafluoroethylene / ceramic based
Materials (PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic).
Usually these materials are expensive.
Reducing the cost is an important means for customers to improve the competitiveness of
Products. Therefore, the customers adopt the laminated structure of mixed materials in the
Design of PCB structure, that is, the necessary signal layer uses high-frequency materials to
Meet the needs of signal transmission. Other line layers are made of conventional fiberglass
Epoxy FR-4, which we call a hybrid board.
Available high frequency material (Core)
RO4350BRO4003C
4mil (0.1mm)8mil (0.203mm)
6.6mil (0.168mm)12mil (0.3mm)
10mil (0.254mm)20mil (0.508mm)
13.3mil (0.338mm)32mil (0.813mm)
20mil (0.508mm)60mil (1.524mm)
30mil (0.762mm)
60mil (1.524mm)
PCB Case: 4 Layer Hybrid PCB on RO4003C and FR-4
with Immersion Gold
(PCB's are custom-made products, the picture and parameters shown are just for reference)
General description
this is a type of 4-layer high frequency PCB built on RO4003C for the application of balanced
Amplifier at 1.6 mm thick. It's immersion gold finish with green solder mask and white legend.
It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards are packed for
Shipment.
Features and benefits
Delamination of copper foil will not be caused by the change of cold and heat due to the
Consistency with the thermal expansion coefficient of copper foil.
Low water absorbability influences dielectric constant and dielectric loss less at damp.
Heat resistance, chemical resistance, impact strength and peeling strength are good.
Gold has high solderability, no stressing of circuit boards and less contamination of PCB
Surface.
Comprehensive equipment management and maintenance and process control,
Strict WIP inspection and monitoring as well as working instruction,
RoHS materials
on-time service
More than 15 years' experience
Application
Transmitter, Radar data acquisition converter, Radio frequency, Trunk amplifier
Parameter and data sheet
Variety of PCBs
Automatic test machine
with the development of electronic communication technology, the communication frequency
Is becoming higher and higher, and the high frequency signal transmission, need to use low
Dielectric constant (Dk), low dielectric loss (Df) but expensive special materials. these materials
Have cyanate and high frequency materials such as polytetrafluoroethylene / ceramic based
Materials (PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic).
Usually these materials are expensive.
Reducing the cost is an important means for customers to improve the competitiveness of
Products. Therefore, the customers adopt the laminated structure of mixed materials in the
Design of PCB structure, that is, the necessary signal layer uses high-frequency materials to
Meet the needs of signal transmission. Other line layers are made of conventional fiberglass
Epoxy FR-4, which we call a hybrid board.
Available high frequency material (Core)
RO4350BRO4003C
4mil (0.1mm)8mil (0.203mm)
6.6mil (0.168mm)12mil (0.3mm)
10mil (0.254mm)20mil (0.508mm)
13.3mil (0.338mm)32mil (0.813mm)
20mil (0.508mm)60mil (1.524mm)
30mil (0.762mm)
60mil (1.524mm)
PCB Case: 4 Layer Hybrid PCB on RO4003C and FR-4
with Immersion Gold
(PCB's are custom-made products, the picture and parameters shown are just for reference)
General description
this is a type of 4-layer high frequency PCB built on RO4003C for the application of balanced
Amplifier at 1.6 mm thick. It's immersion gold finish with green solder mask and white legend.
It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards are packed for
Shipment.
Features and benefits
Delamination of copper foil will not be caused by the change of cold and heat due to the
Consistency with the thermal expansion coefficient of copper foil.
Low water absorbability influences dielectric constant and dielectric loss less at damp.
Heat resistance, chemical resistance, impact strength and peeling strength are good.
Gold has high solderability, no stressing of circuit boards and less contamination of PCB
Surface.
Comprehensive equipment management and maintenance and process control,
Strict WIP inspection and monitoring as well as working instruction,
RoHS materials
on-time service
More than 15 years' experience
Application
Transmitter, Radar data acquisition converter, Radio frequency, Trunk amplifier
Parameter and data sheet
| PCB SIZE | 52 x 39mm=1PCS |
| BOARD TYPE | High frequency PCB, RF PCB |
| Number of Layers | Multilayer PCB, 4 Layer PCB |
| Surface Mount Components | YES |
| through Hole Components | YES |
| LAYER STACKUP | Copper ------- 35um(1oz)+plate TOP layer |
| RO4003C 12mil Er 3.38 | |
| Copper ------- 18um(0.5oz) MidLayer 1 | |
| FR-4 1.0mm | |
| Copper ------- 18um(0.5oz) MidLayer 2 | |
| RO4003C 12mil Er 3.38 | |
| Copper ------- 35um(1oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4mil/4mil |
| Minimum / Maximum Holes: | 0.3/0.5mm |
| Number of Different Holes: | 3 |
| Number of Drill Holes: | 1521 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | Differential pairs impedance control, Layer 3 , 4mil / 4mil , 91 ohm+/-10%, Single trace Impedanc control, Layer 4, 6mil, 49ohm+/-10% |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT-180 TG>170, er<5.4. RO4003C 12mil |
| Final foil external: | 1.5oz |
| Final foil internal: | 0.5oz |
| Final height of PCB: | 1.6mm 0.16 |
| PLATING and COATING | |
| Surface Finish | Immersion Gold (21.5%) 2 micoinch over 100 Microinch nickel |
| Solder Mask Apply to: | Top and Bottom, 12micon Minimum. |
| Solder Mask Color: | Green, LP-4G G-05, Nanya supplied |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through Hole(PTH) |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE of ARTWORK to BE SUPPLIED | Email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Variety of PCBs
Automatic test machine