| Surface Finishing: | Electroless nickel over Immersion Gold (ENIG) |
|---|---|
| Board Thickness: | 2.0mm |
| Copper Thickness: | 1 oz |
| Base Material: | RO4350B core 0.254mm(10mil), RO4450B PP 0.1mm |
| Brand Name: | Bicheng Enterprise Limited |
| Min. Line Spacing: | 5.5 mil |
| Min. Line Width: | 5 mil |
| Min. Hole Size: | 0.3mm |
| Number of Layers: | 10-Layer |
| Model Number: | BIC-010-V10 |
| Place of Origin: | China (Mainland) |
| Solder Mask Color: | Green |
| Colour of Component Legend: | White |
| TEST: | 100% Electrical Test prior shipment |
Quick Details
Specifications
Brief Introduction
RO4350B High Frequency Circuit Material is glass reinforced hydrocarbon/ceramic laminates
(Not PTFE) designed for performance sensitive, high volume commercial applications. Currently
Double sided and multilayer RO4350B PCB's are available at Bicheng company. Double sided
RO4350B PCB with thickness 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm) and 60mil
(1.524mm) are the bestsellers. We provide prototype runs, small batches and volume production
Services.
Advantages
1) Excellent high frequency performance due to low dielectric tolerance and loss;
2) Excellent dimensional stability.
3) Low thermal coefficient of dielectric constant;
4) Low Z-Axis expansion;
5) Low in-plane expansion coefficient;
6) Stable electrical properties verus frequency;
Applications
1) Attenuator, Automatic gate induction;
2) LNB's for direct broadcast satellites;
3) Microstrip antenna, spread spectrum;
4) Microstrip and cellular base station antennas and power amplifiers;
5) RF identifications tags
6) Spread spectrum communications systems
7) Trunk amplifier, splitter module etc.
PCB Case: 10 Layer High Frequency PCB on RO4350B
Core and RO4450B PP
(PCB's are custom-made products, the picture and parameters shown are just for reference)
General description
this is a type of high layer count RF PCB built on RO4350B with RO4450B PP for the
Application of broadbank wireless solutions. It's a 10 layer microwave PCB board at
2.0 mm thick. It's immersion gold finish with solder mask and silkscreen from Taiyo.
It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards are
Packed for shipment.
Features and benefits
Excellent dimensional stability.
Good high temperature and low temperature resistance.(-192-260)
Superior corrosion resistance.
Immersion gold has excellent surface planarity, particularly helpful for PCBs with BGA
Packages or even CSP mounted components to reduce failure rate during assembly and
Soldering.
Engineering design prevents problems from occurring in pre production.
DDU Door to door shipment with competitive shipping cost,
No MOQ, low cost for prototypes and samples.
International approvals
Eligible products rate of first production: >95%
Application
RF transceiver, Communications relays, Low Noise Block, Splitter module
Parameter and data sheet
Variety of PCBs
Developing
RO4350B High Frequency Circuit Material is glass reinforced hydrocarbon/ceramic laminates
(Not PTFE) designed for performance sensitive, high volume commercial applications. Currently
Double sided and multilayer RO4350B PCB's are available at Bicheng company. Double sided
RO4350B PCB with thickness 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm) and 60mil
(1.524mm) are the bestsellers. We provide prototype runs, small batches and volume production
Services.
Advantages
1) Excellent high frequency performance due to low dielectric tolerance and loss;
2) Excellent dimensional stability.
3) Low thermal coefficient of dielectric constant;
4) Low Z-Axis expansion;
5) Low in-plane expansion coefficient;
6) Stable electrical properties verus frequency;
Applications
1) Attenuator, Automatic gate induction;
2) LNB's for direct broadcast satellites;
3) Microstrip antenna, spread spectrum;
4) Microstrip and cellular base station antennas and power amplifiers;
5) RF identifications tags
6) Spread spectrum communications systems
7) Trunk amplifier, splitter module etc.
PCB Case: 10 Layer High Frequency PCB on RO4350B
Core and RO4450B PP
(PCB's are custom-made products, the picture and parameters shown are just for reference)
General description
this is a type of high layer count RF PCB built on RO4350B with RO4450B PP for the
Application of broadbank wireless solutions. It's a 10 layer microwave PCB board at
2.0 mm thick. It's immersion gold finish with solder mask and silkscreen from Taiyo.
It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards are
Packed for shipment.
Features and benefits
Excellent dimensional stability.
Good high temperature and low temperature resistance.(-192-260)
Superior corrosion resistance.
Immersion gold has excellent surface planarity, particularly helpful for PCBs with BGA
Packages or even CSP mounted components to reduce failure rate during assembly and
Soldering.
Engineering design prevents problems from occurring in pre production.
DDU Door to door shipment with competitive shipping cost,
No MOQ, low cost for prototypes and samples.
International approvals
Eligible products rate of first production: >95%
Application
RF transceiver, Communications relays, Low Noise Block, Splitter module
Parameter and data sheet
| PCB SIZE | 175 x 110mm=1PCS=1design |
| BOARD TYPE | High Frequency PCB, Multilayer PCB |
| Number of Layers | 10 layers |
| Surface Mount Components | YES |
| through Hole Components | NO |
| LAYER STACKUP | TOP Layer: signal - 1/2oz foil + 25m Cu |
| Core RO4350B -0.254mm | |
| INT 1: mixed - 1/2oz foil | |
| Prepreg RO4450B -0.202mm (2 x 0.101) | |
| INT 2: mixed - 1/2oz foil | |
| Core RO4350B -0.254mm | |
| INT 3: mixed - 1/2oz foil | |
| Prepreg RO4450B -0.202mm (2 x 0.101) | |
| INT 4: mixed - 1/2oz foil | |
| Core RO4350B -0.254mm | |
| INT 5: mixed - 1/2oz foil | |
| Prepreg RO4450B -0.202mm (2 x 0.101) | |
| INT 6: mixed - 1/2oz foil | |
| Core RO4350B -0.254mm | |
| INT 7: mixed - 1/2oz foil | |
| Prepreg RO4450B -0.202mm (2 x 0.101) | |
| INT 8: mixed - 1/2oz foil | |
| Core RO4350B -0.254mm | |
| BOT Layer: signal - 1/2oz foil + 25m Cu | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5.5mil/5mil |
| Minimum / Maximum Holes: | 0.3/2.0mm |
| Number of Different Holes: | 9 |
| Number of Drill Holes: | 7505 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | NO |
| BOARD MATERIAL | |
| Glass Epoxy: | RO4350B core 0.254mm(10mil), RO4450B PP 0.1mm(4mil) |
| Final foil external: | 1oz |
| Final foil internal: | 0.5oz |
| Final height of PCB: | 2.0mm 10% |
| PLATING and COATING | |
| Surface Finish | Electroless nickel over Immersion Gold (ENIG)( 0.05m over 3m nickel) |
| Solder Mask Apply to: | Top and Bottom, 12micon Minimum. |
| Solder Mask Color: | Green, PSR-2000GT600D, Taiyo supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through Hole(PTH), via tented. BGA Package |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE of ARTWORK to BE SUPPLIED | Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Variety of PCBs
Developing