Brief Introduction
RO4003C High Frequency Circuit Material is glass reinforced hydrocarbon/ceramic laminates
(Not PTFE) designed for performance sensitive, high volume commercial applications. Double
Sided and multilayer RO4003C PCB and hybrid RO4003C PCB are available at Bicheng company
at present. Double sided RO4003c PCB with thickness 12mil (0.305mm), 20mil (0.508mm)
and 32mil (0.813mm) are the bestsellers. We provide prototype runs, small batches and
Volume production services.

Advantages
1) Excellent high frequency performance due to low dielectric tolerance and loss;
2) Excellent dimensional stability.
3) Low thermal coefficient of dielectric constant;
4) Low Z-Axis expansion;
5) Low in-plane expansion coefficient;
6) Stable electrical properties verus frequency;

Applications
1) Attenuator, Automatic gate induction;
2) LNB's for direct broadcast satellites;
3) Microstrip antenna, spread spectrum;
4) Microstrip and cellular base station antennas and power amplifiers;
5) RF identifications tags
6) Spread spectrum communications systems
7) Trunk amplifier, splitter module etc.


PCB Case: RO4003C 32 mil High Frequency PCB
Double Sided.
(PCB's are custom-made products, the picture and parameters shown are just for
Reference)

General description
this is a type of high frequency PCB built on RO4003C for the application of preamplifier.
It's a 2 layer RF PCB board at 0.9 mm thick. It's immersion gold finish with green solder
Mask and white silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using supplied
Gerber data. Each 10 boards are packed for shipment. 


Features and benefits
the characteristic of low dielectric loss makes the signal loss at a lower level, which makes
the signal transmission of the whole equipment excellent.
Delamination of copper foil will not be caused by the change of cold and heat due to the
Consistency with the thermal expansion coefficient of copper foil. 
Low water absorbability influences dielectric constant and dielectric loss less at damp.
ENIG has long storage time ( It can be stored for more than 1 year in vacuum bag)
Comprehensive equipment management and maintenance and process control, 
Thermal stress test, reliability test, insulation resistance test and ionic contamination test,
Great customer service
Eligible products rate of first production: >95%  
on-time service


Application
Mixer, Power splitter, Microstrip antenna, Power divider

Parameter and data sheet

PCB SIZE	45 x 51mm=1PCS
BOARD TYPE	RF PCB
Number of Layers	Double sided PCB
Surface Mount Components	YES
through Hole Components	NO
LAYER STACKUP	Copper ------- 35um(1oz)+plate TOP layer
	RO4003C 32mil (0.813mm)
	Copper ------- 35um(1oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	6.3mil/7.6mil
Minimum / Maximum Holes:	0.66/1.2mm
Number of Different Holes:	5
Number of Drill Holes:	58
Number of Milled Slots:	1
Number of Internal Cutouts:	0
Impedance Control	NO
BOARD MATERIAL
Glass Epoxy:	RO4003C 32mil (0.813mm), Tg 288
Final foil external:	1.5oz
Final foil internal:	0oz
Final height of PCB:	0.9mm 0.1
PLATING and COATING
Surface Finish	Electroless nickel over Immersion Gold (ENIG)( 1 " over 100 " nickel)
Solder Mask Apply to:	Top and Bottom, 12micon Minimum.
Solder Mask Color:	Green, PSR-2000GT600D, Taiyo supplied.
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	TOP
Colour of Component Legend	White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated through Hole(PTH)
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
TYPE of ARTWORK to BE SUPPLIED	Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Variety of PCBs


Disposal prior to Solder mask