Brief Introduction
with the development of electronic communication technology, the communication frequency
Is becoming higher and higher, and the high frequency signal transmission, need to use low
Dielectric constant (Dk), low dielectric loss (Df) but expensive special materials. these materials
Have cyanate and high frequency materials such as polytetrafluoroethylene / ceramic based
Materials (PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic).
Usually these materials are expensive. 
Reducing the cost is an important means for customers to improve the competitiveness of
Products. Therefore, the customers adopt the laminated structure of mixed materials in the
Design of PCB structure, that is, the necessary signal layer uses high-frequency materials to
Meet the needs of signal transmission. Other line layers are made of conventional fiberglass
Epoxy FR-4, which we call a hybrid board.

Available high frequency material (Core)
RO4350BRO4003C
4mil (0.1mm)8mil (0.203mm)
6.6mil (0.168mm)12mil (0.3mm)
10mil (0.254mm)20mil (0.508mm)
13.3mil (0.338mm)32mil (0.813mm)
20mil (0.508mm)60mil (1.524mm)
30mil (0.762mm)
60mil (1.524mm)


PCB Case: 4 Layer Hybrid PCB on RO4003C 12 mil
and FR-4 20 mil Combined
(Printed circuit boards are custom-made products, the picture and parameters shown
Are just for reference)


General description
this is a type of hybrid high frequency PCB built on RO4003C and FR-4 combined for the
Application of digital transimitter. It's a 4 layer RF PCB board at 1.2 mm thick. It's immersion
Gold finish with green solder mask and white silkscreen. It's fabricated per IPC 6012 Class 2
Using supplied Gerber data. Each 10 boards are packed for shipment. 


Features and benefits
RO4003C exhibit a stable dielectric constant over a broad frequency range. this makes
It an ideal substrate for broadband applications.
Excellent high frequency performance due to low dielectric tolerance and loss.
Excellent dimensional stability.
ENIG has good oxidation resistance and good heat dissipation.
Comprehensive equipment management and maintenance and process control, 
High voltage test, Impedance control test, micro-section, solder-ability test, 
Small quantity order is accepted
Delivery on time: >98%  
UL conformed


Application
Modular oscilloscope, Antenna combiner, Balanced amplifier, 3G antenna

Parameter and data sheet

PCB SIZE	183x 115mm=1PCS
BOARD TYPE
Number of Layers	Double sided PCB
Surface Mount Components	YES
through Hole Components	NO
LAYER STACKUP	Copper ------- 17um(0.5oz)+plate TOP layer
	RO4003C 12mil Er 3.38
	Copper ------- 18um(0.5oz) MidLayer 1
	FR-4 0.5mm
	Copper ------- 18um(0.5oz) MidLayer 2
	RO4003C 12mil Er 3.38
	Copper ------- 17um(0.5oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	5.5mil/4.9mil
Minimum / Maximum Holes:	0.3/6.4mm
Number of Different Holes:	6
Number of Drill Holes:	951
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control	NO
BOARD MATERIAL
Glass Epoxy:	RO4003C 12mil mixed with FR-4 0.5mm
Final foil external:	1oz
Final foil internal:	0.5oz
Final height of PCB:	1.2 mm 10%
PLATING and COATING
Surface Finish	Electroless nickel over Immersion Gold (ENIG)( 1 " over 100 " nickel)
Solder Mask Apply to:	Top and Bottom, 12micon Minimum.
Solder Mask Color:	Green, PSR-2000GT600D, Taiyo supplied.
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	TOP
Colour of Component Legend	White, IJR-4000 MW300, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated through Hole(PTH), Via tented
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
TYPE of ARTWORK to BE SUPPLIED	Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Variety of PCBs

High speed flying Test