| Surface Finishing: | Immersion gold |
|---|---|
| Board Thickness: | 1.6mm |
| Copper Thickness: | 1 oz |
| Base Material: | RO4003C 0.305mm (12mil) |
| Brand Name: | Bicheng Enterprise Limited |
| Min. Line Spacing: | 5.9 mil |
| Min. Line Width: | 6.1 mil |
| Min. Hole Size: | 0.3mm |
| Model Number: | BIC-029-V29 |
| Place of Origin: | China (Mainland) |
| Solder Mask Color: | Green |
| Colour of Component Legend: | White |
| TEST: | 100% Electrical Test prior shipment |
Quick Details
Specifications
Brief Introduction
with the development of electronic communication technology, the communication frequency
Is becoming higher and higher, and the high frequency signal transmission, need to use low
Dielectric constant (Dk), low dielectric loss (Df) but expensive special materials. these materials
Have cyanate and high frequency materials such as polytetrafluoroethylene / ceramic based
Materials (PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic). Usually these materials are expensive.
Reducing the cost is an important means for customers to improve the competitiveness of
Products. Therefore, the customers adopt the laminated structure of mixed materials in the
Design of PCB structure, that is, the necessary signal layer uses high-frequency materials to
Meet the needs of signal transmission. Other line layers are made of conventional fiberglass
Epoxy FR-4, which we call a hybrid board.
Available high frequency material (Core)
RO4350BRO4003C
4mil (0.1mm)8mil (0.203mm)
6.6mil (0.168mm)12mil (0.3mm)
10mil (0.254mm)20mil (0.508mm)
13.3mil (0.338mm)32mil (0.813mm)
20mil (0.508mm)60mil (1.524mm)
30mil (0.762mm)
60mil (1.524mm)
PCB Case: 4 Layer Hybrid PCB RO4003C Combined
with FR-4
(Printed circuit boards are custom-made products, the picture and parameters shown are
Just for reference)
General description
this is a type of 4-layer high frequency PCB built on RO4003C and FR-4 combined for
the application of communication networks at 1.6 mm thick. It's immersion gold finish
with green solder mask and white silkscreen. It's fabricated per IPC 6012 Class 2 using
Supplied Gerber data. Each 10 boards are packed for shipment.
Features and benefits
Reducing signal loss in high frequency application meets the development needs of
Communication technology.
the temperature coefficient of dielectric constant is among the lowest of any circuit board
Material, making it ideal for temperature sensitive applications.
Good high temperature and low temperature resistance.(-192-260)
Gold has high solderability, no stressing of circuit boards and less contamination of PCB
Surface.
Help you focus on your core competencies on research and development, sales and
Marketing.
100% tests inclusive of electrical test and AOI inspection.
Fast and flexible to save the time of production from prototype to standard production
Delivery on time: >98%
More than 15 years' experience
Application
RF transceiver, Power splitter, Spread spectrum, 4G antenna
Parameter and data sheet
Variety of PCBs
PCB drill equipement
with the development of electronic communication technology, the communication frequency
Is becoming higher and higher, and the high frequency signal transmission, need to use low
Dielectric constant (Dk), low dielectric loss (Df) but expensive special materials. these materials
Have cyanate and high frequency materials such as polytetrafluoroethylene / ceramic based
Materials (PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic). Usually these materials are expensive.
Reducing the cost is an important means for customers to improve the competitiveness of
Products. Therefore, the customers adopt the laminated structure of mixed materials in the
Design of PCB structure, that is, the necessary signal layer uses high-frequency materials to
Meet the needs of signal transmission. Other line layers are made of conventional fiberglass
Epoxy FR-4, which we call a hybrid board.
Available high frequency material (Core)
RO4350BRO4003C
4mil (0.1mm)8mil (0.203mm)
6.6mil (0.168mm)12mil (0.3mm)
10mil (0.254mm)20mil (0.508mm)
13.3mil (0.338mm)32mil (0.813mm)
20mil (0.508mm)60mil (1.524mm)
30mil (0.762mm)
60mil (1.524mm)
PCB Case: 4 Layer Hybrid PCB RO4003C Combined
with FR-4
(Printed circuit boards are custom-made products, the picture and parameters shown are
Just for reference)
General description
this is a type of 4-layer high frequency PCB built on RO4003C and FR-4 combined for
the application of communication networks at 1.6 mm thick. It's immersion gold finish
with green solder mask and white silkscreen. It's fabricated per IPC 6012 Class 2 using
Supplied Gerber data. Each 10 boards are packed for shipment.
Features and benefits
Reducing signal loss in high frequency application meets the development needs of
Communication technology.
the temperature coefficient of dielectric constant is among the lowest of any circuit board
Material, making it ideal for temperature sensitive applications.
Good high temperature and low temperature resistance.(-192-260)
Gold has high solderability, no stressing of circuit boards and less contamination of PCB
Surface.
Help you focus on your core competencies on research and development, sales and
Marketing.
100% tests inclusive of electrical test and AOI inspection.
Fast and flexible to save the time of production from prototype to standard production
Delivery on time: >98%
More than 15 years' experience
Application
RF transceiver, Power splitter, Spread spectrum, 4G antenna
Parameter and data sheet
| PCB SIZE | 73.5 x 55.97mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Multilayer PCB, 4 layer PCB |
| Surface Mount Components | YES |
| through Hole Components | NO |
| LAYER STACKUP | Copper ------- 17um(0.5oz)+plate TOP layer |
| RO4003C 0.305mm (12mil) | |
| Copper ------- 35um(1oz) MidLayer 1 | |
| RO4450B 0.101mm | |
| Copper ------- 35um(1oz) MidLayer 2 | |
| FR-4 1.0mm | |
| Copper ------- 17um(0.5oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5.9mil/6.1mil |
| Minimum / Maximum Holes: | 0.3/3.5mm |
| Number of Different Holes: | 6 |
| Number of Drill Holes: | 320 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | RO4003C 0.305mm (12mil) and FR-4 1.0mm combined |
| Final foil external: | 1oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 1.6mm 0.16 |
| PLATING and COATING | |
| Surface Finish | Immersion Gold (15.4%) 2 micoinch over 100 microinch Nickel |
| Solder Mask Apply to: | TOP and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, PSR-2000 GT600D, Taiyo Supplied. |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing. Fiducial marks |
| MARKING | |
| Side of Component Legend | TOP. |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through hole(PTH), via tented. Blind via from top Layer to Inner layer 1. Inner layer 2 to Bottom layer. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE of ARTWORK to BE SUPPLIED | Email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Variety of PCBs
PCB drill equipement