Brief Introduction
with the development of electronic communication technology, the communication frequency
Is becoming higher and higher, and the high frequency signal transmission, need to use low
Dielectric constant (Dk), low dielectric loss (Df) but expensive special materials. these materials
Have cyanate and high frequency materials such as polytetrafluoroethylene / ceramic based
Materials (PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic).
Usually these materials are expensive. 
Reducing the cost is an important means for customers to improve the competitiveness of
Products. Therefore, the customers adopt the laminated structure of mixed materials in the
Design of PCB structure, that is, the necessary signal layer uses high-frequency materials to
Meet the needs of signal transmission. Other line layers are made of conventional fiberglass
Epoxy FR-4, which we call a hybrid board.

Available high frequency material (Core)
RO4350BRO4003C
4mil (0.1mm)8mil (0.203mm)
6.6mil (0.168mm)12mil (0.3mm)
10mil (0.254mm)20mil (0.508mm)
13.3mil (0.338mm)32mil (0.813mm)
20mil (0.508mm)60mil (1.524mm)
30mil (0.762mm)
60mil (1.524mm)


PCB Case: 4 Layer Hybrid PCB on 20 mil RO4350B
and 28 mil FR-4 Green Mask ENIG
(Printed circuit boards are custom-made products, the picture and parameters shown are
Just for reference)

General description
this is a type of 4-layer high frequency PCB built on RO4350B and FR-4 combined for the
Application of amplifier at 1.2 mm thick. It's immersion gold finish with green solder mask
and white silkscreen. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each
10 boards are packed for shipment. 


Features and benefits
the characteristic of low dielectric loss makes the signal loss at a lower level, which makes
the signal transmission of the whole equipment excellent.
RO4350B exhibits a stable dielectric constant over a broad frequency range. this makes it
An ideal substrate for broadband applications.
Reducing signal loss in high frequency application meets the development needs of communication technology.
Gold has high solderability, no stressing of circuit boards and less contamination of PCB
Surface.
Right manufacturing instruction (MI), 
Make delivery on time keeping 98% on-time-delivery rate.
Fast and flexible to save the time of production from prototype to standard production
Reduce manufacturing cost from advanced equipment import, worker training and
Technology improvement and management.
Competitive price

Application
Mixer, Variocoupler, RFID, Base station antenna

Parameter and data sheet