| Surface Finishing: | Immersion gold |
|---|---|
| Board Thickness: | 1.6mm |
| Copper Thickness: | 1.5 oz |
| Base Material: | FR-4+ RO4003C 20mil |
| Brand Name: | Bicheng Enterprise Limited |
| Min. Line Spacing: | 5 mil |
| Min. Line Width: | 5 mil |
| Min. Hole Size: | 0.3mm |
| Model Number: | BIC-032-V32 |
| Place of Origin: | China (Mainland) |
| Solder Mask Color: | Green |
| Colour of Component Legend: | White |
| TEST: | 100% Electrical Test prior shipment |
Quick Details
Specifications
Brief Introduction
with the development of electronic communication technology, the communication frequency
Is becoming higher and higher, and the high frequency signal transmission, need to use low
Dielectric constant (Dk), low dielectric loss (Df) but expensive special materials. these materials
Have cyanate and high frequency materials such as polytetrafluoroethylene / ceramic based
Materials (PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic).
Usually these materials are expensive.
Reducing the cost is an important means for customers to improve the competitiveness of
Products. Therefore, the customers adopt the laminated structure of mixed materials in the
Design of PCB structure, that is, the necessary signal layer uses high-frequency materials to
Meet the needs of signal transmission. Other line layers are made of conventional fiberglass
Epoxy FR-4, which we call a hybrid board.
Available high frequency material (Core)
RO4350BRO4003C
4mil (0.1mm)8mil (0.203mm)
6.6mil (0.168mm)12mil (0.3mm)
10mil (0.254mm)20mil (0.508mm)
13.3mil (0.338mm)32mil (0.813mm)
20mil (0.508mm)60mil (1.524mm)
30mil (0.762mm)
60mil (1.524mm)
PCB Case: 4 Layer PCB on RO4003C and FR-4 Green
Solder Mask Immersion Gold
(Printed circuit boards are custom-made products, the picture and parameters shown are
Just for reference)
General description
this is a type of 4 layer hybrid PCB built on RO4003C and FR-4 combined for the application
of balanced amplifier at 1.6 mm thick. It's immersion gold finish with green solder mask and
White silkscreen. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10
Boards are packed for shipment.
Features and benefits
Delamination of copper foil will not be caused by the change of cold and heat due to the
Consistency with the thermal expansion coefficient of copper foil.
the temperature coefficient of dielectric constant is among the lowest of any circuit board
Material, making it ideal for temperature sensitive applications.
RO4003C exhibit a stable dielectric constant over a broad frequency range. this makes it
An ideal substrate for broadband applications.
SMT process is resistant to reflow soldering, resistant to rework due to gold pads.
100% tests inclusive of electrical test and AOI inspection.
Comprehensive equipment management and maintenance and process control,
Small quantity order is accepted
Customer complaint rate: <1%
RoHS materials
Application
Multiplexer, Photocoupler, Frequency converter, Combiner
Parameter and data sheet
Variety of PCBs
PCB high speed multihead drilling machine
with the development of electronic communication technology, the communication frequency
Is becoming higher and higher, and the high frequency signal transmission, need to use low
Dielectric constant (Dk), low dielectric loss (Df) but expensive special materials. these materials
Have cyanate and high frequency materials such as polytetrafluoroethylene / ceramic based
Materials (PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic).
Usually these materials are expensive.
Reducing the cost is an important means for customers to improve the competitiveness of
Products. Therefore, the customers adopt the laminated structure of mixed materials in the
Design of PCB structure, that is, the necessary signal layer uses high-frequency materials to
Meet the needs of signal transmission. Other line layers are made of conventional fiberglass
Epoxy FR-4, which we call a hybrid board.
Available high frequency material (Core)
RO4350BRO4003C
4mil (0.1mm)8mil (0.203mm)
6.6mil (0.168mm)12mil (0.3mm)
10mil (0.254mm)20mil (0.508mm)
13.3mil (0.338mm)32mil (0.813mm)
20mil (0.508mm)60mil (1.524mm)
30mil (0.762mm)
60mil (1.524mm)
PCB Case: 4 Layer PCB on RO4003C and FR-4 Green
Solder Mask Immersion Gold
(Printed circuit boards are custom-made products, the picture and parameters shown are
Just for reference)
General description
this is a type of 4 layer hybrid PCB built on RO4003C and FR-4 combined for the application
of balanced amplifier at 1.6 mm thick. It's immersion gold finish with green solder mask and
White silkscreen. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 10
Boards are packed for shipment.
Features and benefits
Delamination of copper foil will not be caused by the change of cold and heat due to the
Consistency with the thermal expansion coefficient of copper foil.
the temperature coefficient of dielectric constant is among the lowest of any circuit board
Material, making it ideal for temperature sensitive applications.
RO4003C exhibit a stable dielectric constant over a broad frequency range. this makes it
An ideal substrate for broadband applications.
SMT process is resistant to reflow soldering, resistant to rework due to gold pads.
100% tests inclusive of electrical test and AOI inspection.
Comprehensive equipment management and maintenance and process control,
Small quantity order is accepted
Customer complaint rate: <1%
RoHS materials
Application
Multiplexer, Photocoupler, Frequency converter, Combiner
Parameter and data sheet
| PCB SIZE | 81 x 61mm=1PCS |
| BOARD TYPE | Hybrid PCB |
| Number of Layers | Multilayer PCB, 4 Layer PCB |
| Surface Mount Components | YES |
| through Hole Components | no |
| LAYER STACKUP | Copper ------- 35um(1oz)+plate TOP layer |
| RO4003C 20mil Er 3.38 | |
| Copper ------- 35um(1oz) MidLayer 1 | |
| FR-4 0.4mm | |
| Copper ------- 35um(1oz) MidLayer 2 | |
| RO4003C 20mil Er 3.38 | |
| Copper ------- 35um(1oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5mil/5mil |
| Minimum / Maximum Holes: | 0.3/3.5mm |
| Number of Different Holes: | 4 |
| Number of Drill Holes: | 912 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 1 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT-180 TG>170, er<5.4. RO4003C 20mil |
| Final foil external: | 1.5oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 1.6mm 0.16 |
| PLATING and COATING | |
| Surface Finish | Immersion Gold (16.5%) 2 micoinch over 100 microinch Nickel |
| Solder Mask Apply to: | Top and Bottom, 12micon Minimum. |
| Solder Mask Color: | Green, LP-4G G-05, Nanya supplied |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated through Hole(PTH), via tented |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE of ARTWORK to BE SUPPLIED | Email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Variety of PCBs
PCB high speed multihead drilling machine