Brief Introduction
with the development of electronic communication technology, the communication frequency
Is becoming higher and higher, and the high frequency signal transmission, need to use low
Dielectric constant (Dk), low dielectric loss (Df) but expensive special materials. these materials
Have cyanate and high frequency materials such as polytetrafluoroethylene / ceramic based
Materials (PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic).
Usually these materials are expensive. 
Reducing the cost is an important means for customers to improve the competitiveness of
Products. Therefore, the customers adopt the laminated structure of mixed materials in the
Design of PCB structure, that is, the necessary signal layer uses high-frequency materials to
Meet the needs of signal transmission. Other line layers are made of conventional fiberglass
Epoxy FR-4, which we call a hybrid board.

Available high frequency material (Core)
RO4350BRO4003C
4mil (0.1mm)8mil (0.203mm)
6.6mil (0.168mm)12mil (0.3mm)
10mil (0.254mm)20mil (0.508mm)
13.3mil (0.338mm)32mil (0.813mm)
20mil (0.508mm)60mil (1.524mm)
30mil (0.762mm)
60mil (1.524mm)


PCB Case: 4 Layer Hybrid PCB on RO4003C + RO4450F
+ FR4 Combined
(Printed circuit boards are custom-made products, the picture and parameters shown are
Just for reference)

General description
this is a type of high frequency PCB built on RO4003C and FR-4 combined for the application
of modular oscilloscope. It's a 4 layer RF PCB board at 1.0 mm thick. It's HASL finish without
Solder mask. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20 boards
Are packed for shipment. 


Features and benefits
Heat resistance, chemical resistance, impact strength and peeling strength are good.
Excellent high frequency performance due to low dielectric tolerance and loss.
Excellent dimensional stability.
ENIG has good oxidation resistance and good heat dissipation.
Help you focus on your core competencies on research and development, sales and
Marketing.
Whole fabrication processes are totally controlled. 
No MOQ, low cost for prototypes and samples. 
Eligible products rate of first production: >95%  
UL recognized and RoHS Directive-compliant

Application
Satellite antenna, Antenna combiner, Power amplifier, Multicoupler

Parameter and data sheet

PCB SIZE	76 x 41mm=1PCS
BOARD TYPE	Hybrid PCB
Number of Layers	Multilayer PCB, 4 layer PCB
Surface Mount Components	YES
through Hole Components	NO
LAYER STACKUP	Copper ------- 35um(1oz)+plate TOP layer
	RO4003C 0.305mm (12mil)
	Copper ------- 35um(1oz) MidLayer 1
	RO4450F 0.101mm
	Copper ------- 35um(1oz) MidLayer 2
	FR-4 0.25mm
	Copper ------- 17um(0.5oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	5mil/6mil
Minimum / Maximum Holes:	0.3/5.5mm
Number of Different Holes:	7
Number of Drill Holes:	491
Number of Milled Slots:	0
Number of Internal Cutouts:	2
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	RO4003C 0.305mm (12mil) and FR-4 0.25mm combined
Final foil external:	1oz
Final foil internal:	1oz
Final height of PCB:	1.0mm 0.1
PLATING and COATING
Surface Finish	HASL Lead free
Solder Mask Apply to:	Not applicable
Solder Mask Color:	NO
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	Not applicable
Colour of Component Legend	NO
Manufacturer Name or Logo:	N/A
VIA	Plated through hole(PTH), via open
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
TYPE of ARTWORK to BE SUPPLIED	Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Variety of PCBs

Peeling strength tester