Brief Introduction
Just as its name implies, high frequency is that the frequency is relatively high, generally
Refers to the frequency of >=300 MHz (i.e. Wave length <=1m), that is, the usual radio
Frequency band. the electromagnetic wave of frequency >=1GHz is named microwave.
Typical frequencies for wireless applications:
* Current: 0.9GHz - 2GHz
* 3G systems: 2.5GHz
* Bluetooth: 2.5GHz
* GPS: 12.6GHz
* LMDS: 24GHz and 40GHz
* Automotive: 77GHz
Market: RFID, Wireless communications, base station and antenna, amplifier, military products,
Consumer electronics.  
High frequency printed circuit board or microwave PCB refers to the printed circuit board made
on the high frequency (microwave) substrate copper clad plate. the common types are: Double
-sided board, multilayer board and mixed structure.
Mixed structure includes high performance special substrate, PP sheet + ordinary performance
Board and PP sheet mixed pressing board; high frequency substrate + ordinary FR4 substrate;
High frequency substrate + metal base etc.



PCB Case: RF PCB Board Built on RO4350B 20 mil with
Immersion Gold
(Printed circuit boards are custom-made products, the picture and parameters shown are
Just for reference)


General description
this is a type of double sided high frequency PCB built on RO4350B 20 mil substrate for the
Application of antenna. It's a 2 layer RF PCB board at 0.6 mm thick. It's immersion gold finish
without solder mask. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 20
Boards are packed for shipment. 


Features and benefits
Delamination of copper foil will not be caused by the change of cold and heat due to the
Consistency with the thermal expansion coefficient of copper foil. 
Stable electrical coefficient of dielectric constant.
Heat resistance, chemical resistance, impact strength and peeling strength are good.
Immersion gold has excellent surface planarity, particularly helpful for PCBs with BGA
Packages or even CSP mounted components to reduce failure rate during assembly and
Soldering.
Whole fabrication processes are totally controlled. 
Thermal stress test, reliability test, insulation resistance test and ionic contamination test,
1-10 pieces are offered.
Reduce manufacturing cost from advanced equipment import, worker training and
Technology improvement and management.
UL conformed

Application
Balanced mixer, Multicoupler combiner, Tower-mounted booster, Power amplifier 

Parameter and data sheet