Brief Introduction
with the development of electronic communication technology, the communication frequency
Is becoming higher and higher, and the high frequency signal transmission, need to use low
Dielectric constant (Dk), low dielectric loss (Df) but expensive special materials. these materials
Have cyanate and high frequency materials such as polytetrafluoroethylene / ceramic based
Materials (PTFE/Ceramic), hydrocarbons / ceramic based materials (Hydra Carbon/Ceramic).
Usually these materials are expensive. 
Reducing the cost is an important means for customers to improve the competitiveness of
Products. Therefore, the customers adopt the laminated structure of mixed materials in the
Design of PCB structure, that is, the necessary signal layer uses high-frequency materials to
Meet the needs of signal transmission. Other line layers are made of conventional fiberglass
Epoxy FR-4, which named a hybrid board.

Available high frequency material (Core)
RO4350BRO4003C
4mil (0.1mm)8mil (0.203mm)
6.6mil (0.168mm)12mil (0.3mm)
10mil (0.254mm)20mil (0.508mm)
13.3mil (0.338mm)32mil (0.813mm)
20mil (0.508mm)60mil (1.524mm)
30mil (0.762mm)
60mil (1.524mm)

PCB Case: Hybrid PCB | Mixed Material PCB Built on 20 mil RO4350B Plus FR-4 with Blind Via
(Printed circuit boards are custom-made products, the picture and parameters shown are
Just for reference)

General description
this is a type of mixed material multilayer PCB built on 20 mil RO4350B plus FR-4 substrate
for the application of satellite antenna. It's 1.69 mm thick, white silkscreen over green solder
Mask on both sides and immersion gold is plated on pads and tracks. the base material is
Used from Rogers and ITEQ, entire board supplying 1 PCB up. They're fabricated per IPC
6012 Class 2 using supplied Gerber data. Each 25 boards are packed for shipment. 

Features and benefits
RO4350B exhibits a stable dielectric constant over a broad frequency range;
Excellent high frequency performance due to low dielectric tolerance and loss;
SI performance improvement over the stack-UPS with all FR4 board;
Cost reduction over stack-UPS with all low loss material;
Long storage time which can be stored for more than 1 year in vacuum bag;
ISO9001, ISO14001, UL certified manufacturing factory;
PCB manufacturing on required specifications;
No MOQ, low cost for prototypes and small runs quantity;
8000 types of PCB per month;

Application
LNA,Radar data acquisition converter,Spread spectrum, 3G antenna

Parameter and data sheet

PCB SIZE	99 x 85mm=1PCS
BOARD TYPE	Multilayer PCB
Number of Layers	6 layers
Surface Mount Components	YES
through Hole Components	YES
LAYER STACKUP	Copper --------18um(0.5 oz)+plate TOP layer
	RO4350B 0.508mm
	Copper ------- 18um(0.5 oz)
	Prepreg 2313 x 2, 0.2mm
	Copper ------- 35um (1 oz)
	FR-4 0.305mm
	Copper ------- 35um (1 oz)
	Prepreg 2313 x 2, 0.2mm
	Copper ------- 35um (1 oz)
	FR-4 0.305mm
	Copper --------18um(0.5 oz)+plate BOT layer
TECHNOLOGY
Minimum Trace and Space:	15mil / 15 mil
Minimum / Maximum Holes:	0.4 mm / 2.5 mm
Number of Different Holes:	4
Number of Drill Holes:	89
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	RO4350B Tg280, er<3.48, Rogers Corp. IT158 FR-4
Final foil external:	1 oz
Final foil internal:	1 oz
Final height of PCB:	1.69 mm 10%
PLATING and COATING
Surface Finish	Immersion gold 0.053 micron over nickle  Micron
Solder Mask Apply to:	both sides
Solder Mask Color:	Green, LP-4G/G-05, Nanya
Solder Mask Type:	LPI
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	Top Side
Colour of Component Legend	White, S-380W, Taiyo
Manufacturer Name or Logo:	N/A
VIA	Plated through hole(PTH), minimum size 0.4mm. Blind via L1-L2, L5-L6, L3-L6
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE of ARTWORK to BE SUPPLIED	Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Variety of PCBs