* Excellent cutting ability that help reduce chipping, fractures and achive smooth surface finish

* Dicing hard and brittle materials. Such as QFN/MLF, Thick Ceramic Substrates and Glass, etc

* Able to precisely control diamond concentration to achieve cutting quality

* Self sharpening matrix to expose new diamonds. Diamond grit size ranges from 3m to 250m depending on blade thickness

Applications of resin bond dicing blade

Glass (optical devices, fiber optics), quartz (optical splitters, Saw devices), LiTa03 LiNb03 (devices), QFN (copper epoxy molding ), Splitter, sapphire