Metal bonded Back grinding wheel

the grinding wheel is mainly used for LED Industry sapphire epitaxial wafer, silicon wafer, gallium arsenide, GaN wafer Back thinning.

the grinding LED substrate grinding wheel Produced by our company can replace imported products with guaranteed quality, Stable use, superior grinding performance and high cost performance.

Features

High precision grinding workpiece, good Surface quality,

Shape retention of the workpiece is good,

High grinding efficiency,

Low grinding force and low grinding Temperature

Resin bond back grinding wheel

Resin thinning grinding wheel takes Thermosetting resin as binder and diamond as grinding particle.Compared with Metal bond and ceramic bond, resin bond grinding wheel has many advantages, Such as abundant elasticity, good self-sharpening and no blockage.Therefore, Resin bonded grinding wheel has high machining efficiency and low machining Heat.

Features

Excellent self-sharpening and elasticity

High machining efficiency and low machining Temperature

High machining precision and surface Quality

Vitrified bond back grinding wheel

Vitrified bond back grinding wheel are Mainly used in the thin and fine machining of semiconductor wafers, with the Characteristic high self-sharpening sharpness of ceramic binders, no need for Online knife sharpening, and at the same time can achieve a higher feed speed To reduce the processing time, at the same time, this product can also give Consideration to a longer service life.

Features

the use of porous ceramic bond, with a Higher self sharpening

High feed speed, up to 500um/min, greatly Improve the processing efficiency

Due to the unique formulation of the Binder, not only the processing quality is excellent, but also the grinding Wheel itself wear is low, can obtain a longer service life

Processing workpiece of Back gtinding wheel

Sapphire wafer silicon wafer gallium Arsenide GaZ

Specification

SD	400	M	254D	5W	10X
Abrasive	grit	bond	Diameter	wide(W)	high(X)
Synthetic Diamond	270-8000	M-metal	200-304	2-7	5-10

Bond	code	Workpiece	Application	Feature
Diamond	M	Sapphire	Rough grinding	Long life
Vitrified	V	Silicon	Rough/finish grinding	Porous sharp, can be used for ordinary and ultra-thin wafer Processing
Resin	R	Saphire	Rough/finish grinding	High grinding efficiency