1.Brief Introduction:

Applicable workpieces:

     Processable materials: glass, ceramics, resins, stone, sapphire, silicon, copper, stainless steel, various alloys, and thin filmMaterials.

     Applicable industries: scientific research, semiconductor, biomedical, etc.

  

 

2.Techincal parameters:

Working area: 250mm250mm (X-Y-axes)

 Power: 60/40/20W@1064nm (customizable)

 Wavelength: 1064/532/355nm

 Pulse width: <13ps

 Focal spot diameter: 10-25m (adjustable)

 Maximum operating speed: 800mm/s(X-Y-axes); 20mm/s(Z-axis)

  

 

3.Performance features:

 Excellent laser beam quality to ensure long-run stability.

 Minimal heat-affected zone.

 Higher single-pulse energy power and processing precision for the capability to process all kinds of solid materials.

 Non-contact machining; improved processing quality and yields.

 Excellent processing flexibility; able to cut any shape.

 Software can be customized to meet the demands of each customer's applications.

 Integrated system design features an anti-seismic marble platform to improve the machine's operating stability.

 Specialized dust collection system maintains the cleanliness of the processing environment and increases the duration of the equipment's life cycle.

 Specialized vacuum adsorption fixture improves processing stability and efficiency.