| Application: | Other |
|---|---|
| After-sales Service Provided: | Engineers available to service machinery overseas |
| Brand Name: | Delphi |
| Certification: | ISO |
| Laser Type: | Ultra-Short Pulse Laser |
| Application: | LTCC/HTCC |
| Place of Origin: | China (Mainland) |
| Applicable Material: | Ceramics |
Quick Details
Specifications
Ultra-Short Pulse Laser Drilling and Etching System for LTCC/HTCC
1.Brief Introduction:
Sample Figure
1.Brief Introduction:
Technical Specifications for LTCC:
Processable materials: low temperature co-fired ceramic (LTCC)
Processing aperture: 20m
Processing precision: 5m
Working area: 400mmX400mm
Processing speed: 1000-2000 holes per second
Technical Specification for Laser Exposure:
Working area: 800mmX800mm
Minimum line width: 1m
Positional accuracy: 0.5m
Surface roughness: 0.1m
Sample Figure