High Thermal Conductive Silicon Pad

Features & Benefits: 

L Cost-effective, high conductivity, low thermal resistance

L Soft and flexible, reducing the interface thermal resistance

L High electrical insulation to protect electronic devices

L Natural sticky, easy application, reworkable

L Meet ROHS and UL environmental requirements

Typical Applications: 

L High thermal conductivity module

L new energy vehicles

L Microprocessors, memory chips and graphics processors

L Network communication equipment

L Car equipment, charger

High-speed hard disk drive   

Physical Properties:

Test Item	TEst Method	Unit	LC200	LC250	LC300	LC400
Color	Visual	-	Blue	Blue	Blue	Gray
THickness	ASTM D374	mm	0.3~10	0.3~10	0.3~10	0.5~5
HArdness	ASTM D2240	Shore00	40~80	40~80	40~80	60~80
Specific Gravity	ASTM D792	g/cm3	2.5	2.8	3	3.24
TEnsile Strength	ASTM D412	Mpa	0.29	0.25	0.19	0.14
Elongation	ASTM D412	%	45	60	40	32
TEar Strength	GBT 529-2008	KN/m	0.9	0.6	0.9	0.7
BReakdown Voltage	ASTM D149	KV/mm	10	10	10	5
VOlume Resistivity	ASTM D257	cm	51012	71013	11012	11013
Continuous Use Temp	EN344		-40~200	-40~200	-40~200	-40~200
Flame Rating	UL 94	-	V-0	V-0	V-0	V-0
WEight Loss	@150240H	%	0.3%	0.3%	0.3%	0.5%
Dielectric Constant	ASTM D150	@1MHz	5.69	6.79	7.0	6.75
Thermal Conductivity	ISO 22007-2	W/mK	2.0	2.5	3.0	4.0

Standard size:200mm400mm, 300mm400mm; Customized size available; 

Coated with fiberglass/one side or double side adhesive/aluminum foil available.

for more, please feel free to contact rita at szutd.com