Ultra-High Thermal Conductive Silicon Pad

Features & Benefits:

L High thermal conductivity, low thermal resistance

L Soft and flexible, reducing the interface thermal resistance

L High electrical insulation to protect sensitive electronic devices

L Natural sticky, easy assembly, re-workable

L Meet ROHS and UL environmental requirements

Typical Applications:   

L CPU, memory module

L Communication hardware equipment

L High-speed hard disk drive

L Automotive engine control module

L Microprocessors, memory chips and graphics processors

Military electronic equipment  

Physical Properties:

Test Item	TEst Method	Unit	LC500	LC600	LC700	LC800
Color	Visual	-	Gray	Gray	Gray	Gray
THickness	ASTM D374	mm	0.5~5	0.5~5	1.0~5	1.0~5
HArdness	ASTM D2240	Shore00	60~80	60~80	60~80	60~80
Specific Gravity	ASTM D792	g/cm3	3.32	3.43	3.5	3.55
TEnsile Strength	ASTM D412	Mpa	0.2	0.22	0.15	0.15
Elongation	ASTM D412	%	60	16	24	24
TEar Strength	GBT 529-2008	KN/m	0.5	0.5	0.5	0.5
BReakdown Voltage	ASTM D149	KV/mm	7	7	7	7
VOlume Resistivity	ASTM D257	cm	21013	21013	31011	31011
Continuous Use Temp	EN344		-40~200	-40~200	-40~200	-40~200
Flame Rating	UL94	-	V-0	V-0	V-0	V-0
WEight Loss	@150240H	%	0.5	0.5	0.5	0.5
Dielectric Constant	ASTM D150	@1MHz	7.92	7.47	8.0	8.0
Thermal Conductivity	ISO 22007-2	W/mK	5.0	6.0	7.0	8.0

Standard size:200mm400mm, 300mm400mm; Customized size available; 

Coated with fiberglass/one side or double side adhesive/aluminum foil available.

for more, please feel free to contact us:  rita at szutd.com