Feature/Function:

*Dual-use sputtering and evaporation function, less occupied area, Competitive price, stable performance and low maintenance costs;

*Can Be used for the preparation of single and multi-layer metal film, Dielectric film, semiconductor film, magnetic film, sensor film, Heat-resistant alloy film, hard film, corrosion-resistant film, etc.;

*Coating samples: silver, aluminum, copper, nickel, chromium, nickel-chromium alloy, titanium oxide, ITO, silica, etc.;

 

Application:Colleges & universities, research institutes and enterprises develop new thin film materials and samll batch production.

 

Technical Parameters:

Equipment Name:     Magnetron Sputtering System

Model:                        JCP200

Chamber Structure:     Vertical top cover structure, bottom pumping system, manual pneumatic spring pull open

Chamber Size:              210H310mm

Baking Temperature:    Room temperature to 350

Sputtering Path:           Upward

Rotating Substrate Holder:             100mm

Film Thickness Nonuniformity:       Within the scope of 50mm5.0%

Sputtering Target/Evaporation Electrode:  1 PC of 2 Inches magnetron target, Reserved 1 group of evaporation electrode interface

Process Gas:            1-2 Routes gas flow control

Control Method:       PLC Control/IPC automatic control(optional)

Occupied Area:        (Mainframe) L600W800H1700mm

Power:                       7kW