Feature/Function:

*Dual-use sputtering and evaporation function, less occupied area, Competitive price, stable performance and low maintenance costs;

*Can Be used for the preparation of single and multi-layer metal film, Dielectric film, semiconductor film, magnetic film, sensor film, Heat-resistant alloy film, hard film, corrosion-resistant film, etc.;

*Coating samples: silver, aluminum, copper, nickel, chromium, nickel-chromium alloy, titanium oxide, ITO, silica, etc.;

* Single target sputtering, multi-target sputtering in turns, multi-target sputtering simultaneously and so on functions.

 

Application:Colleges & universities, research institutes and enterprises develop new thin film materials and samll batch production.

 

Technical Parameters:

Equipment Name:        Magnetron Sputtering System

Model:                          JCP350

Chamber Structure:       Vertical top cover structure, rear pumping system, automatic pneumatic open type

Chamber Size:               350H350mm

Baking Temperature:       Room temperature to 500

Sputtering Path:                Upward

Rotating Substrate Holder:        120mm

Film Thickness Nonuniformity:    Within the scope of 75mm5.0%

Sputtering Target/Evaporation Electrode:    2 Pcs of 2 Inches magnetron targets, reserved 1 pc of target position

Process Gas:              2-3 Routes gas flow control

Control Method:          PLC Control/IPC automatic control(optional)

Occupied Area:            (Mainframe) L1600W800H1700mm

Power:                          10kW