Feature/Function:

*Dual-use sputtering and evaporation function, less occupied area, Competitive price, stable performance and low maintenance costs;

*Can Be used for the preparation of single and multi-layer metal film, Dielectric film, semiconductor film, magnetic film, sensor film, Heat-resistant alloy film, hard film, corrosion-resistant film, etc.;

*Coating samples: silver, aluminum, copper, nickel, chromium, nickel-chromium alloy, titanium oxide, ITO, silica, etc.;

* Single target sputtering, multi-target sputtering in turns, multi-target sputtering simultaneously and so on functions.

 

Application:Colleges & universities, research institutes and enterprises develop new thin film materials and samll batch production.

 

Technical Parameters:

Equipment Name:                    Magnetron Sputtering System

Model:                                         JCP500

Chamber Structure:                    Vertical front door structure, rear pumping system

Chamber Size:                             500H420mm

Baking Temperature:                   Room temperature to 500

Sputtering Path:                            Upward/downward(optional)

Rotating Substrate Holder:           150mm

Film Thickness Nonuniformity:      Within the scope of 100mm5.0%

Sputtering Target/Evaporation Electrode:    2~4 Pcs of 2, 3, 4 Inches magnetron targets (optional)

Process Gas:            2-3 Routes gas flow control

Control Method:         PLC Control/IPC automatic control(optional)

Occupied Area:           (Mainframe) L1800W800H1900mm

Power:                           15kW