Feature:Equipped with circular magnetron sputtering target, rectangular Magnetron sputtering target, multi-arc target, magnetic filter arc Source, etc. Combined with magnetron, ion plating and other various Functions, suitable for the universities and scientific research units with multiple coating requirements.

Main Function:

* the equipment can be used to prepare single and multi-layer metal Film, dielectric film, semiconductor film, sensor film, heat-resistant Alloy film, hard film, corrosion-resistant film, etc.;
* Coating Samples: silver, aluminum, copper, nickel, chromium, nickel-chromium Alloy, titanium nitride, titanium carbide, titanium Nitride, chromium nitride, titanium oxide, alumina, ITO, etc.;
* Applications: tool, mold, electronic accessories, metal shell, ceramic substrate, etc..

Application:Widely used in colleges & universities, research institutes and Enterprises of device R & D and manufacturing and small batch Production.

Technical Parameters

Equipment Name	Magnetron & Ion Sputtering Combination System
Model	TSU650
Chamber Structure	Vertical cylindrical front door structure, double-layer water cooling
Chamber Size	650H650mm
Rotating Workpiece Rack	350H400mm, 4~6 workstations revolution/rotation workpiece rest
Workpiece Rack Baking  Temperature	Room temperature~5005(93241), adjustable and controllable  (PID control temperature)
Workpiece Rack Movement	0-5RPM adjustable
Auxiliary ion source	Bias voltage, auxiliary linear ion source(optional)
Cathode	Rectangular magnetron target, plane arc source, magnetic filter arc source,  circular flat target(optional)
Control Method	PLC Control/IPC automatic control(optional)
Occupied Area	(Mainframe) L2780W1200H2020mm
Power	70kW