| Brand Name: | SECrosslink |
|---|---|
| Usage: | Electronics Industry |
| Main Raw Material: | Epoxy |
| Classification: | Other Adhesives |
| Other Names: | Silver Adhesive |
Quick Details
Specifications
Brand |
SECrosslink |
Type |
SECrosslink-6063 |
Product |
Low temperature curing type Conductive silver adhesive |
Curing temperature |
100 |
Adhesive types |
Epoxy |
Application |
Electronics and semiconductors |
Appearance |
Silver gray |
Density |
4.5g/cm3 |
Content of effective elements |
87% |
Volume resistivity |
cm |
Curing time |
0.5h |
Shelf life |
6 months |
SECrosslink-6063 is solvent-free and fast curing at low temperature. It is used for electronic components, ceramics, glass, silicon wafers, metals and other components that need to be bonded. It is suitable for FIP process.
